There are several challenges that come with designing small PCB’s (55*55.3mm) for vibration proof applications. Because of its modularized nature, LGA is a good solution. DFI, a global established company in computing technology, will take you through their design, layout and manufacturing (including soldering) process of LGA modules to help you overcome these challenges. You will get an exclusive look into the design process of LGA modules (including detailed drawings, block diagrams, schematics, layouts) by DFI while also sharing their vision, experience and providing useful insights.
The presentation will also focus on:
– DFI AI plan (open VINO, FPGA , Movidius )
– Rugged design on ML&AI applications: CPU LGA module – LGA concept on AI board (detailed drawing w/IC)
– Architecting the next Edge generation for embedded IoT applications
– Some of the application concepts: automation – automotive – drones and unmanned systems – retail and security
We hope to see you on November 7th!
Jarry Chang, Diamond Flower Inc. on behalf of Intemo