{"id":34713,"date":"2022-09-19T12:13:00","date_gmt":"2022-09-19T10:13:00","guid":{"rendered":"https:\/\/fhi.nl\/nieuws\/accelonix-wots2022-die-bonding-demonstrations\/"},"modified":"2024-07-10T13:20:38","modified_gmt":"2024-07-10T11:20:38","slug":"accelonix-wots2022-die-bonding-demonstrations","status":"publish","type":"news","link":"https:\/\/fhi.nl\/en\/news\/accelonix-wots2022-die-bonding-demonstrations\/","title":{"rendered":"Accelonix @ WOTS2022: Those Bonding Demonstrations"},"content":{"rendered":"<header id=\"header\" class=\"header header--low\">\n\n\t\n\t\t\t<div class=\"header__background header__background--graphic\"><\/div>\n\t\n\t<div class=\"container\">\n\t\t<div class=\"header__content\">\n\t\t\t<div class=\"header__first header__first--alone\">\n\n\t\t\t\t\n\t\t\t\t\n\t\t\t\t\n\t\t\t\t<h1 class=\"header__title\" >\n\t\t\t\t\tAccelonix @ WOTS2022: Those Bonding Demonstrations\t\t\t\t<\/h1>\n\n\t\t\t\t<div class=\"header__dots-line\">\n\t\t\t\t\t<svg width=\"431\" height=\"9\" viewbox=\"0 0 431 9\" fill=\"none\" xmlns=\"http:\/\/www.w3.org\/2000\/svg\"><path d=\"M430.799 4.192a1.136 1.136 0 1 1-2.272-.001 1.136 1.136 0 0 1 2.272 0Zm-27.272 0a1.135 1.135 0 1 1-2.27 0 1.135 1.135 0 0 1 2.27 0Zm-27.27 0a1.136 1.136 0 1 1-2.272-.001 1.136 1.136 0 0 1 2.272 0Zm-27.272 0a1.39 1.39 0 1 1-2.78 0 1.39 1.39 0 0 1 2.78 0Zm-27.78 0a1.645 1.645 0 1 1-3.29 0 1.645 1.645 0 0 1 3.29 0Zm-28.29 0a1.9 1.9 0 1 1-3.799 0 1.9 1.9 0 0 1 3.799 0Zm-28.799 0a2.154 2.154 0 1 1-4.308 0 2.154 2.154 0 0 1 4.308 0Zm-29.308 0a2.41 2.41 0 1 1-4.819 0 2.41 2.41 0 0 1 4.819 0Zm-29.819 0a2.663 2.663 0 1 1-5.326.001 2.663 2.663 0 0 1 5.326-.001Zm-30.327 0a2.919 2.919 0 1 1-5.837 0 2.919 2.919 0 0 1 5.837 0Zm-30.837 0a3.173 3.173 0 1 1-6.345.001 3.173 3.173 0 0 1 6.345 0Zm-31.346 0a3.428 3.428 0 1 1-6.856 0 3.428 3.428 0 0 1 6.856 0Zm-31.856 0a3.683 3.683 0 1 1-7.365 0 3.683 3.683 0 0 1 7.365 0Zm-32.365 0a3.937 3.937 0 1 1-7.875 0 3.937 3.937 0 0 1 7.875 0Zm-32.874 0a4.192 4.192 0 1 1-8.384 0 4.192 4.192 0 0 1 8.384 0Z\" fill=\"#FFF960\"\/><\/svg>\t\t\t\t<\/div>\n\n\t\t\t\t\n\t\t\t\t\n\t\t\t<\/div>\n\n\t\t\t\n\t\t<\/div>\n\t<\/div>\n<\/header>\n\n\t<div class=\"header__meta header__meta--footer\">\n\t<div class=\"container\">\n\t\t<div class=\"header__meta__category\">\n\n\t\t\t\n\t\t\t\t\t\t\t<div class=\"header__meta__detail\">\n\t\t\t\t\t<div>Subject<\/div>\n\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t<a href=\"https:\/\/fhi.nl\/en\/kennishub\/?_onderwerp_kennishub=cleanroom-apparatuur\" class=\"header__meta__detail--categorie\">\n\t\t\t\t\t\t\t\tCleanroom equipment\t\t\t\t\t\t\t<\/a>\n\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t<a href=\"https:\/\/fhi.nl\/en\/kennishub\/?_onderwerp_kennishub=design-embedded\" class=\"header__meta__detail--categorie\">\n\t\t\t\t\t\t\t\tDesign &amp; Embedded\t\t\t\t\t\t\t<\/a>\n\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t<a href=\"https:\/\/fhi.nl\/en\/kennishub\/?_onderwerp_kennishub=elektronicaproductie\" class=\"header__meta__detail--categorie\">\n\t\t\t\t\t\t\t\tElectronics manufacturing\t\t\t\t\t\t\t<\/a>\n\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t<a href=\"https:\/\/fhi.nl\/en\/kennishub\/?_onderwerp_kennishub=industriele-elektronica\" class=\"header__meta__detail--categorie\">\n\t\t\t\t\t\t\t\tIndustrial Electronics\t\t\t\t\t\t\t<\/a>\n\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t<a href=\"https:\/\/fhi.nl\/en\/kennishub\/?_onderwerp_kennishub=microtechnologie\" class=\"header__meta__detail--categorie\">\n\t\t\t\t\t\t\t\tMicrotechnology\t\t\t\t\t\t\t<\/a>\n\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t<a href=\"https:\/\/fhi.nl\/en\/kennishub\/?_onderwerp_kennishub=productie-test-apparatuur-services\" class=\"header__meta__detail--categorie\">\n\t\t\t\t\t\t\t\tProduction Test Equipment\/Services\t\t\t\t\t\t\t<\/a>\n\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t<a href=\"https:\/\/fhi.nl\/en\/kennishub\/?_onderwerp_kennishub=productieapparatuur\" class=\"header__meta__detail--categorie\">\n\t\t\t\t\t\t\t\tProduction equipment\t\t\t\t\t\t\t<\/a>\n\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\n\t\t<\/div>\n\t<\/div>\n<\/div>\n\n<div class=\"text bg--white\">\n\t<div class=\"container\">\n\t\t\t\t\t\t\t\t\t\t\t<div class=\"text__content text__content--1-col\">\n\t\t\t<p><strong>Discover the Tresky T-5100 \u2013 PC controlled manual die bonder \u2013 during WOTS 2022 at the Accelonix booth \u2013 9C014.<\/strong><br \/><strong>Epoxy, eutectic solder, flip chip, sinter: one system to support all die attach processes!<\/strong><\/p>\r\n<p>The T-5100 is a universal manual die bonder suitable for a wide range of micro-assembly tasks. The equipment features a superior ergonomic design, high-accuracy, a large 220 x 220mm assembly area with 125 mm of vertical travel and an integrated time\/pressure dispenser, making it ideal for R&amp;D through low volume production or custom assembly.<\/p>\r\n<table border=\"0\">\r\n<tbody>\r\n<tr>\r\n<td>\r\n<h4><a href=\"https:\/\/accelonix.nl\/product\/metrology\/cybertechnologies\/ct-series\/ct100\/\">Dr. Tresky \u2013 T-5100<\/a><\/h4>\r\n<ul>\r\n<li>Manual Die Bonder with pickup from up to 200mm wafer<\/li>\r\n<li>Pick &amp; place die from waffle pack, gel pack and tape etc.<\/li>\r\n<li>Sub-micron placement capability<\/li>\r\n<li>For epoxy, eutectic-solder, flip chip &amp; sinter die attach processes etc.<\/li>\r\n<li>Precision die to die and die on die placement capability<\/li>\r\n<li>Integrated time pressure dispenser, optional stamping unit<\/li>\r\n<li>Simple to use with excellent ergonomics &amp; high build quality<\/li>\r\n<li>Modular system covers virtually all those pick-place applications<\/li>\r\n<li><strong>True Vertical Technology<\/strong>\u2122, guarantees parallelism during bonding<\/li>\r\n<\/ul>\r\n<\/td>\r\n<td><a href=\"https:\/\/accelonix.nl\/wp-content\/uploads\/T5100-WOTS.png\"><img decoding=\"async\" src=\"https:\/\/accelonix.nl\/wp-content\/uploads\/T5100-WOTS.png\" alt=\"\" width=\"616\" height=\"469\" \/><\/a><\/td>\r\n<\/tr>\r\n<\/tbody>\r\n<\/table>\r\n<p>The machines rigid base is compact, fits on a lab desk and can be expanded with many different options, including eutectic scrub, gas heating, preform handling, tool heating, ultrasonic bonding, die flip and dynamic heated tooling etc., ensuring the system can be configured to suit even the most demanding manual that bonds requirements.<\/p>\r\n<p><a href=\"https:\/\/accelonix.nl\/product-cat\/micro-electronics\/die-bonding\/tresky-manual-diebonders\/\">For more information, datasheets and video about the Tresky T-5100 and other Tresky Die Bonders please click here.<\/a><\/p>\r\n<p><strong>PS: On our booth you will also find solutions for X-Ray inspection, EMC and RF testing, wire bonding and software solutions for electronics (DFT, test coverage, NPI, Traceability and repair).<\/strong><\/p>\r\n<p><a href=\"https:\/\/www.databadge.net\/wots2022\/reg\/?link=02d3e12d564a913952e7&amp;lan=EN\" target=\"_blank\" rel=\"noopener\"><img decoding=\"async\" src=\"https:\/\/accelonix.nl\/wp-content\/uploads\/WoTS-banner-560-x-200px.png\" alt=\"\" width=\"560\" height=\"200\" \/><\/a><\/p>\r\n<p><a href=\"https:\/\/www.databadge.net\/wots2022\/reg\/?link=02d3e12d564a913952e7&amp;lan=EN\" target=\"_blank\" rel=\"noopener\">Click to register your free ticket. Visit us at booth 9C014<\/a><\/p>\t\t<\/div>\n\t<\/div>\n<\/div>\r\n\t<div class=\"articles bg--offwhite automatic\">\r\n\t\t<div class=\"container\">\r\n\t\t\t<div class=\"articles__header\">\r\n\t\t\t\t\t\t\t\t\t<div class='heading-wrapper'><svg width=\"13\" height=\"13\" viewbox=\"0 0 13 13\" fill=\"none\" xmlns=\"http:\/\/www.w3.org\/2000\/svg\"><circle cx=\"6.394\" cy=\"6.5\" r=\"6.394\" fill=\"#000\"\/><\/svg><h2>Related articles<\/h2><\/div>\t\t\t\t\t\t\t\t\t\t\t\t\t<a href=\"\/en\/profiel\/accelonix-bv\/\" class=\"button button--outline\">view profile<\/a>\r\n\t\t\t\t\t\t\t<\/div>\r\n\t\t\t\t\t\t<div class=\"post-grid post-grid--no-padding\">\r\n\t\t\t\t\n<a class=\"single-item single-item__articles\" href=\"https:\/\/fhi.nl\/en\/news\/30-jaar-partnerschap-tussen-hitma-en-barksdale\/\" data-id=\"82098\">\n\t<div class=\"single-item__articles-icon\">\n\t\t<svg width=\"35\" height=\"35\" viewbox=\"0 0 35 35\" fill=\"none\" xmlns=\"http:\/\/www.w3.org\/2000\/svg\">\n<mask id=\"mask0_1182_5532\" style=\"mask-type:luminance\" maskunits=\"userSpaceOnUse\" x=\"0\" y=\"0\" width=\"35\" height=\"35\">\n<path d=\"M0 0H35V35H0V0Z\" fill=\"white\"\/>\n<\/mask>\n<g mask=\"url(#mask0_1182_5532)\">\n<path d=\"M5.12695 9.22852H1.02539V31.9238H10.4299C12.2868 31.9238 14.0678 32.6615 15.3809 33.9746H19.6191C20.9322 32.6615 22.7132 31.9238 24.5701 31.9238H33.9746V11.2793H29.873\" stroke=\"#2A5CEE\" stroke-width=\"2\" stroke-miterlimit=\"10\"\/>\n<path d=\"M17.5 9.22852H18.1426C20.0088 7.89544 22.2237 7.17773 24.5615 7.17773H29.873V27.8223H24.5615C22.2237 27.8223 20.0088 28.54 18.1426 29.873H16.8574C14.9912 28.54 12.7763 27.8223 10.4385 27.8223H5.12695V5.12695H9.22852\" stroke=\"#2A5CEE\" stroke-width=\"2\" stroke-miterlimit=\"10\"\/>\n<path d=\"M9.22852 1.02539V21.6699C13.759 21.6699 17.5 25.3425 17.5 29.873V9.22852C17.5 4.698 13.759 1.02539 9.22852 1.02539Z\" stroke=\"#2A5CEE\" stroke-width=\"2\" stroke-miterlimit=\"10\"\/>\n<\/g>\n<\/svg>\n\t<\/div>\n\t<div class=\"single-item__articles-title\"><div class='heading-wrapper'><h3>30 years of partnership between Hitma and Barksdale<\/h3><\/div><\/div>\n\t<div class=\"single-item__articles-terms\">\n\t\t\n\t\t\n\t\t\t\t\t\t<span class=\"button button--outline single-item__articles-term--branche single-item__articles-term\">Industrial automation<\/span>\n\t\t\t\t\t\t\t\t<span class=\"button button--outline single-item__articles-term--branche single-item__articles-term\">Hardware for automation<\/span>\n\t\t\t\t\t\t\t\t<span class=\"button button--outline single-item__articles-term--branche single-item__articles-term\">Industrial communication<\/span>\n\t\t\t\t\t\t\t\t<span class=\"button button--outline single-item__articles-term--branche single-item__articles-term\">Members content<\/span>\n\t\t\t\t\t<\/div>\n\t<div class=\"single-item__articles-author-date-wrapper\">\n\t\t\t\t\t<div class=\"single-item__articles-author\">\n\t\t\t\tHitma\t\t\t<\/div>\n\t\t\t\t\t\t\t<div class=\"single-item__articles-date\">\n\t\t\t\t7 May 2026\t\t\t<\/div>\n\t\t\t<\/div>\n<\/a>\n\n<a class=\"single-item single-item__articles\" href=\"https:\/\/fhi.nl\/en\/news\/kort-economisch-nieuws-van-30-april-2021\/\" data-id=\"39120\">\n\t<div class=\"single-item__articles-icon\">\n\t\t<svg width=\"35\" height=\"35\" viewbox=\"0 0 35 35\" fill=\"none\" xmlns=\"http:\/\/www.w3.org\/2000\/svg\">\n<mask id=\"mask0_1182_5532\" style=\"mask-type:luminance\" maskunits=\"userSpaceOnUse\" x=\"0\" y=\"0\" width=\"35\" height=\"35\">\n<path d=\"M0 0H35V35H0V0Z\" fill=\"white\"\/>\n<\/mask>\n<g mask=\"url(#mask0_1182_5532)\">\n<path d=\"M5.12695 9.22852H1.02539V31.9238H10.4299C12.2868 31.9238 14.0678 32.6615 15.3809 33.9746H19.6191C20.9322 32.6615 22.7132 31.9238 24.5701 31.9238H33.9746V11.2793H29.873\" stroke=\"#2A5CEE\" stroke-width=\"2\" stroke-miterlimit=\"10\"\/>\n<path d=\"M17.5 9.22852H18.1426C20.0088 7.89544 22.2237 7.17773 24.5615 7.17773H29.873V27.8223H24.5615C22.2237 27.8223 20.0088 28.54 18.1426 29.873H16.8574C14.9912 28.54 12.7763 27.8223 10.4385 27.8223H5.12695V5.12695H9.22852\" stroke=\"#2A5CEE\" stroke-width=\"2\" stroke-miterlimit=\"10\"\/>\n<path d=\"M9.22852 1.02539V21.6699C13.759 21.6699 17.5 25.3425 17.5 29.873V9.22852C17.5 4.698 13.759 1.02539 9.22852 1.02539Z\" stroke=\"#2A5CEE\" stroke-width=\"2\" stroke-miterlimit=\"10\"\/>\n<\/g>\n<\/svg>\n\t<\/div>\n\t<div class=\"single-item__articles-title\"><div class='heading-wrapper'><h3>Brief economic news of April 30, 2021<\/h3><\/div><\/div>\n\t<div class=\"single-item__articles-terms\">\n\t\t\n\t\t\n\t\t\t\t\t\t<span class=\"button button--outline single-item__articles-term--branche single-item__articles-term\">Federated<\/span>\n\t\t\t\t\t\t\t\t<span class=\"button button--outline single-item__articles-term--branche single-item__articles-term\">Economy<\/span>\n\t\t\t\t\t<\/div>\n\t<div class=\"single-item__articles-author-date-wrapper\">\n\t\t\t\t\t<div class=\"single-item__articles-author\">\n\t\t\t\tFHI, Federation of Technology Industries\t\t\t<\/div>\n\t\t\t\t\t\t\t<div class=\"single-item__articles-date\">\n\t\t\t\tApril 30, 2021\t\t\t<\/div>\n\t\t\t<\/div>\n<\/a>\n\t\t\t<\/div>\r\n\t\t<\/div>\r\n\t<\/div>","protected":false},"excerpt":{"rendered":"","protected":false},"featured_media":34714,"template":"","branches":[],"events":[8],"secretariat":[],"categories":[182,18,20,57,172,187,185],"themes_tax":[],"content_types":[514],"class_list":["post-34713","news","type-news","status-publish","has-post-thumbnail","hentry"],"acf":[],"yoast_head":"<!-- This site is optimized with the Yoast SEO plugin v26.8 - https:\/\/yoast.com\/product\/yoast-seo-wordpress\/ -->\n<title>Discover the Tresky T-5100 - PC controlled manual die bonder<\/title>\n<meta name=\"description\" content=\"Epoxy, eutectic-solder, flip chip, sinter:\" \/>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" 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