{"id":80591,"date":"2026-03-25T11:12:00","date_gmt":"2026-03-25T10:12:00","guid":{"rendered":"https:\/\/fhi.nl\/nieuws\/scaling-up-rethinking-photonics-testing-for-todays-ai-enabled-data-centers\/"},"modified":"2026-03-25T11:15:57","modified_gmt":"2026-03-25T10:15:57","slug":"scaling-up-rethinking-photonics-testing-for-todays-ai-enabled-data-centers","status":"publish","type":"news","link":"https:\/\/fhi.nl\/en\/news\/scaling-up-rethinking-photonics-testing-for-todays-ai-enabled-data-centers\/","title":{"rendered":"Scaling Up: Rethinking Photonics Testing for Today&#039;s AI-Enabled Data Centers"},"content":{"rendered":"<header id=\"header\" class=\"header header--high header--branch\">\n\n\t\t\t\t\t\t\t\t\t\t<div class=\"header__background header__background--high\">\n\t\t\t\t\t<img decoding=\"async\" class=\"header__background-image\" src=\"https:\/\/fhi.nl\/app\/uploads\/2026\/03\/scaling-up_image_1000x700.jpg\" alt=\"\">\n\t\t\t\t<\/div>\n\t\t\t\t\t\t\n\t\n\t<div class=\"container\">\n\t\t<div class=\"header__content\">\n\t\t\t<div class=\"header__first\">\n\n\t\t\t\t\n\t\t\t\t\n\t\t\t\t\n\t\t\t\t<h1 class=\"header__title\" >\n\t\t\t\t\tScaling Up: Rethinking Photonics Testing for Today&#039;s AI-Enabled Data Centers\t\t\t\t<\/h1>\n\n\t\t\t\t<div class=\"header__dots-line\">\n\t\t\t\t\t<svg width=\"431\" height=\"9\" viewbox=\"0 0 431 9\" fill=\"none\" xmlns=\"http:\/\/www.w3.org\/2000\/svg\"><path d=\"M430.799 4.192a1.136 1.136 0 1 1-2.272-.001 1.136 1.136 0 0 1 2.272 0Zm-27.272 0a1.135 1.135 0 1 1-2.27 0 1.135 1.135 0 0 1 2.27 0Zm-27.27 0a1.136 1.136 0 1 1-2.272-.001 1.136 1.136 0 0 1 2.272 0Zm-27.272 0a1.39 1.39 0 1 1-2.78 0 1.39 1.39 0 0 1 2.78 0Zm-27.78 0a1.645 1.645 0 1 1-3.29 0 1.645 1.645 0 0 1 3.29 0Zm-28.29 0a1.9 1.9 0 1 1-3.799 0 1.9 1.9 0 0 1 3.799 0Zm-28.799 0a2.154 2.154 0 1 1-4.308 0 2.154 2.154 0 0 1 4.308 0Zm-29.308 0a2.41 2.41 0 1 1-4.819 0 2.41 2.41 0 0 1 4.819 0Zm-29.819 0a2.663 2.663 0 1 1-5.326.001 2.663 2.663 0 0 1 5.326-.001Zm-30.327 0a2.919 2.919 0 1 1-5.837 0 2.919 2.919 0 0 1 5.837 0Zm-30.837 0a3.173 3.173 0 1 1-6.345.001 3.173 3.173 0 0 1 6.345 0Zm-31.346 0a3.428 3.428 0 1 1-6.856 0 3.428 3.428 0 0 1 6.856 0Zm-31.856 0a3.683 3.683 0 1 1-7.365 0 3.683 3.683 0 0 1 7.365 0Zm-32.365 0a3.937 3.937 0 1 1-7.875 0 3.937 3.937 0 0 1 7.875 0Zm-32.874 0a4.192 4.192 0 1 1-8.384 0 4.192 4.192 0 0 1 8.384 0Z\" fill=\"#FFF960\"\/><\/svg>\t\t\t\t<\/div>\n\n\t\t\t\t\n\t\t\t\t\n\t\t\t<\/div>\n\n\t\t\t\t\t\t\t<div class=\"header__second\">\n\n\t\t\t\t\t\n\t\t\t\t\t\n\t\t\t\t\t\n\t\t\t\t\t\t\t\t\t\t\t<div class=\"header__branch-logos\">\n\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t<img decoding=\"async\" src=\"https:\/\/fhi.nl\/app\/uploads\/2024\/02\/Industriele-elektronica.svg\" class=\"header__branch-logo\" alt=\"\" \/>\t\t\t\t\t\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t\t\n\t\t\t\t\t\n\t\t\t\t\t\n\t\t\t\t<\/div>\n\t\t\t\n\t\t<\/div>\n\t<\/div>\n<\/header>\n\n\t<div class=\"header__meta\">\n\t<div class=\"container\">\n\t\t<div class=\"header__meta__category\">\n\n\t\t\t\t\t\t\t<div class=\"header__meta__detail\">\n\t\t\t\t\t<div>Branch<\/div>\n\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t<a href=\"https:\/\/fhi.nl\/en\/kennishub\/?_branches_kennishub=industriele-elektronica\" class=\"header__meta__detail--branch\">\n\t\t\t\t\t\t\t\tIndustrial Electronics\t\t\t\t\t\t\t<\/a>\n\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\n\t\t\t\t\t\t\t<div class=\"header__meta__detail\">\n\t\t\t\t\t<div>Subject<\/div>\n\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t<a href=\"https:\/\/fhi.nl\/en\/kennishub\/?_onderwerp_kennishub=communicatie-technologie\" class=\"header__meta__detail--categorie\">\n\t\t\t\t\t\t\t\tCommunication technology\t\t\t\t\t\t\t<\/a>\n\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t<a href=\"https:\/\/fhi.nl\/en\/kennishub\/?_onderwerp_kennishub=datacenter-computerruimtes\" class=\"header__meta__detail--categorie\">\n\t\t\t\t\t\t\t\tData center\/computer rooms\t\t\t\t\t\t\t<\/a>\n\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t<a href=\"https:\/\/fhi.nl\/en\/kennishub\/?_onderwerp_kennishub=industriele-elektronica\" class=\"header__meta__detail--categorie\">\n\t\t\t\t\t\t\t\tIndustrial Electronics\t\t\t\t\t\t\t<\/a>\n\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\n\t\t<\/div>\n\t<\/div>\n<\/div>\n\n<div class=\"text bg--white\">\n\t<div class=\"container\">\n\t\t\t\t\t\t\t\t\t\t\t<div class=\"text__content text__content--1-col\">\n\t\t\t<div class=\"inner-block text option-text\">\r\n<p class=\"has-medium-font-size\">The data center industry is undergoing one of its most significant transitions in a decade. As AI, cloud, and high-performance computing workloads continue to surge, operators are turning to optical interconnects, co-packaged optics (CPO), and photonic integrated circuits (PICs) to meet unprecedented bandwidth and power-efficiency demands. We&#039;re seeing higher beachfront density, more wavelengths per device, and escalating channel counts \u2013 all pushing optical architectures to the limits of what traditional test strategies can handle.<\/p>\r\n<p>These technology shifts come with a fundamental challenge: high-volume optical test is not yet scaling like electrical wafer-level testing has in traditional semiconductor fabrication. PICs and CPO modules require characterization of optical parameters across wafer, die, and module stages, fiber\u2011array alignment and attachment, and 100% test coverage for high\u2011speed I\/O validation at 100G and beyond. With dozens of channels and multiple wavelengths per device, serial test approaches simply can&#039;t keep up.<\/p>\r\n<\/div>\r\n<div class=\"inner-block text option-image\">\r\n<div class=\"image\"><img decoding=\"async\" src=\"https:\/\/cnrood.com\/wp-content\/uploads\/2026\/03\/new_optical_interconnect_data_devices.png\" alt=\"\" \/>\r\n<p class=\"caption\">New and emerging optical interconnect solutions from major vendors driving the next wave of high\u2011bandwidth data center architectures.<\/p>\r\n<\/div>\r\n<\/div>\r\n<div class=\"inner-block text option-text\">\r\n<p>To support the next wave of optical interconnect innovation, the industry needs true scalable and parallel test capability. That means high-density instruments, synchronized mixed-signal measurement, parallel optical power generation and measurement, parallel at-speed optical testing, and test systems that flexibly transition from validation into high-volume manufacturing. This is exactly where the combination of PXI and automated test equipment (ATE) has proven transformative.<br \/>PXI offers a mature, multi-vendor ecosystem with integrated timing, synchronization, and automation \u2013 all essential for testing complex photonic devices at scale. It enables engineers to pack more capability into a smaller footprint while achieving correlation between stimulus and measured data across large channel counts. And because PXI integrates readily with existing equipment such as wafer probers, alignment systems, and automation software, it becomes the backbone of a unified, scalable test strategy.<\/p>\r\n<p>But success requires more than technology. It requires collaboration across the ecosystem \u2013 from PIC\/CPO developers, foundries, OSATs and CMs, to equipment vendors and software partners. By working together, we can accelerate the adoption of optical interconnects and ensure the test capability keeps pace with the innovation it enables.<\/p>\r\n<p>For a deeper look at the technology and test methodologies shaping this transition, I recommend reading our white papers on PXI-based high-volume PIC testing and strategies for validating next-generation optical interconnects.<\/p>\r\n<\/div>\t\t<\/div>\n\t<\/div>\n<\/div>\r\n\t<div class=\"articles bg--offwhite automatic\">\r\n\t\t<div class=\"container\">\r\n\t\t\t<div class=\"articles__header\">\r\n\t\t\t\t\t\t\t\t\t<div class='heading-wrapper'><svg width=\"13\" height=\"13\" viewbox=\"0 0 13 13\" fill=\"none\" xmlns=\"http:\/\/www.w3.org\/2000\/svg\"><circle cx=\"6.394\" cy=\"6.5\" r=\"6.394\" fill=\"#000\"\/><\/svg><h2>Related articles<\/h2><\/div>\t\t\t\t\t\t\t\t\t\t\t\t\t<a href=\"\/en\/profiel\/cn-rood\/\" class=\"button button--outline\">view profile<\/a>\r\n\t\t\t\t\t\t\t<\/div>\r\n\t\t\t\t\t\t<div class=\"post-grid post-grid--no-padding\">\r\n\t\t\t\t\n<a class=\"single-item single-item__articles\" href=\"https:\/\/fhi.nl\/en\/news\/david-temt-goliath\/\" data-id=\"36254\">\n\t<div class=\"single-item__articles-icon\">\n\t\t<svg width=\"35\" height=\"35\" viewbox=\"0 0 35 35\" fill=\"none\" xmlns=\"http:\/\/www.w3.org\/2000\/svg\">\n<mask id=\"mask0_1182_5532\" style=\"mask-type:luminance\" maskunits=\"userSpaceOnUse\" x=\"0\" y=\"0\" width=\"35\" height=\"35\">\n<path d=\"M0 0H35V35H0V0Z\" fill=\"white\"\/>\n<\/mask>\n<g mask=\"url(#mask0_1182_5532)\">\n<path d=\"M5.12695 9.22852H1.02539V31.9238H10.4299C12.2868 31.9238 14.0678 32.6615 15.3809 33.9746H19.6191C20.9322 32.6615 22.7132 31.9238 24.5701 31.9238H33.9746V11.2793H29.873\" stroke=\"#2A5CEE\" stroke-width=\"2\" stroke-miterlimit=\"10\"\/>\n<path d=\"M17.5 9.22852H18.1426C20.0088 7.89544 22.2237 7.17773 24.5615 7.17773H29.873V27.8223H24.5615C22.2237 27.8223 20.0088 28.54 18.1426 29.873H16.8574C14.9912 28.54 12.7763 27.8223 10.4385 27.8223H5.12695V5.12695H9.22852\" stroke=\"#2A5CEE\" stroke-width=\"2\" stroke-miterlimit=\"10\"\/>\n<path d=\"M9.22852 1.02539V21.6699C13.759 21.6699 17.5 25.3425 17.5 29.873V9.22852C17.5 4.698 13.759 1.02539 9.22852 1.02539Z\" stroke=\"#2A5CEE\" stroke-width=\"2\" stroke-miterlimit=\"10\"\/>\n<\/g>\n<\/svg>\n\t<\/div>\n\t<div class=\"single-item__articles-title\"><div class='heading-wrapper'><h3>David tames Goliath<\/h3><\/div><\/div>\n\t<div class=\"single-item__articles-terms\">\n\t\t\n\t\t\n\t\t\t\t\t\t<span class=\"button button--outline single-item__articles-term--branche single-item__articles-term\">World of Industry, Technology &amp; Science<\/span>\n\t\t\t\t\t\t\t\t<span class=\"button button--outline single-item__articles-term--branche single-item__articles-term\">Members content<\/span>\n\t\t\t\t\t<\/div>\n\t<div class=\"single-item__articles-author-date-wrapper\">\n\t\t\t\t\t<div class=\"single-item__articles-author\">\n\t\t\t\tAPEX Dynamics BV\t\t\t<\/div>\n\t\t\t\t\t\t\t<div class=\"single-item__articles-date\">\n\t\t\t\tApril 12, 2022\t\t\t<\/div>\n\t\t\t<\/div>\n<\/a>\n\n<a class=\"single-item single-item__articles\" href=\"https:\/\/fhi.nl\/en\/news\/de-ontwikkeling-van-een-tweede-generatie-ku-band-multi-carrier-testsysteem-voor-hoogvermogen-microgolf-testen-aan-satelliet-componenten\/\" data-id=\"40634\">\n\t<div class=\"single-item__articles-icon\">\n\t\t<svg width=\"35\" height=\"35\" viewbox=\"0 0 35 35\" fill=\"none\" xmlns=\"http:\/\/www.w3.org\/2000\/svg\">\n<mask id=\"mask0_1182_5532\" style=\"mask-type:luminance\" maskunits=\"userSpaceOnUse\" x=\"0\" y=\"0\" width=\"35\" height=\"35\">\n<path d=\"M0 0H35V35H0V0Z\" fill=\"white\"\/>\n<\/mask>\n<g mask=\"url(#mask0_1182_5532)\">\n<path d=\"M5.12695 9.22852H1.02539V31.9238H10.4299C12.2868 31.9238 14.0678 32.6615 15.3809 33.9746H19.6191C20.9322 32.6615 22.7132 31.9238 24.5701 31.9238H33.9746V11.2793H29.873\" stroke=\"#2A5CEE\" stroke-width=\"2\" stroke-miterlimit=\"10\"\/>\n<path d=\"M17.5 9.22852H18.1426C20.0088 7.89544 22.2237 7.17773 24.5615 7.17773H29.873V27.8223H24.5615C22.2237 27.8223 20.0088 28.54 18.1426 29.873H16.8574C14.9912 28.54 12.7763 27.8223 10.4385 27.8223H5.12695V5.12695H9.22852\" stroke=\"#2A5CEE\" stroke-width=\"2\" stroke-miterlimit=\"10\"\/>\n<path d=\"M9.22852 1.02539V21.6699C13.759 21.6699 17.5 25.3425 17.5 29.873V9.22852C17.5 4.698 13.759 1.02539 9.22852 1.02539Z\" stroke=\"#2A5CEE\" stroke-width=\"2\" stroke-miterlimit=\"10\"\/>\n<\/g>\n<\/svg>\n\t<\/div>\n\t<div class=\"single-item__articles-title\"><div class='heading-wrapper'><h3>The development of a second generation Ku-band Multi Carrier test system for high-power microwave testing of satellite components<\/h3><\/div><\/div>\n\t<div class=\"single-item__articles-terms\">\n\t\t\n\t\t\n\t\t\t\t\t\t<span class=\"button button--outline single-item__articles-term--branche single-item__articles-term\">Industrial Electronics<\/span>\n\t\t\t\t\t\t\t\t<span class=\"button button--outline single-item__articles-term--branche single-item__articles-term\">RF Technology Event<\/span>\n\t\t\t\t\t<\/div>\n\t<div class=\"single-item__articles-author-date-wrapper\">\n\t\t\t\t\t<div class=\"single-item__articles-author\">\n\t\t\t\tFHI, Federation of Technology Industries\t\t\t<\/div>\n\t\t\t\t\t\t\t<div class=\"single-item__articles-date\">\n\t\t\t\tNovember 10, 2020\t\t\t<\/div>\n\t\t\t<\/div>\n<\/a>\n\t\t\t<\/div>\r\n\t\t<\/div>\r\n\t<\/div>","protected":false},"excerpt":{"rendered":"<p>The data center industry is undergoing one of its most significant transitions in a decade. As AI, cloud, and high-performance computing workloads continue to surge, operators are turning to optical interconnects, co-packaged optics (CPO), and photonic integrated circuits (PICs) to meet unprecedented bandwidth and power-efficiency demands. We&#039;re seeing higher beachfront density, more wavelengths per device, and escalating channel counts \u2013 all pushing optical architectures to the limits of what traditional test strategies can handle.<\/p>","protected":false},"featured_media":80592,"template":"","branches":[13],"events":[361,9,370,368,8],"secretariat":[],"categories":[16,17,57],"themes_tax":[523],"content_types":[514],"class_list":["post-80591","news","type-news","status-publish","has-post-thumbnail","hentry"],"acf":[],"yoast_head":"<!-- This site is optimized with the Yoast SEO plugin v26.8 - https:\/\/yoast.com\/product\/yoast-seo-wordpress\/ -->\n<title>Scaling Up: Rethinking Photonics Testing for Today\u2019s AI-Enabled Data Centers<\/title>\n<meta name=\"description\" content=\"As AI, cloud, and high\u2011performance computing workloads continue to surge, operators are turning to optical interconnects, co\u2011packaged optics (CPO), and photonic integrated circuits (PICs) to meet unprecedented bandwidth and 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