{"id":82911,"date":"2025-07-09T13:56:00","date_gmt":"2025-07-09T11:56:00","guid":{"rendered":"https:\/\/fhi.nl\/nieuws\/mastering-signal-and-power-integrity-with-ansys-based-simulation\/"},"modified":"2026-05-29T14:07:00","modified_gmt":"2026-05-29T12:07:00","slug":"mastering-signal-and-power-integrity-with-ansys-based-simulation","status":"publish","type":"news","link":"https:\/\/fhi.nl\/en\/news\/mastering-signal-and-power-integrity-with-ansys-based-simulation\/","title":{"rendered":"Mastering Signal and Power Integrity \u2013 with ANSYS-Based Simulation"},"content":{"rendered":"<header id=\"header\" class=\"header header--high header--branch\">\n\n\t\t\t\t\t\t\t\t\t\t<div class=\"header__background header__background--high\">\n\t\t\t\t\t<img decoding=\"async\" class=\"header__background-image\" src=\"https:\/\/fhi.nl\/app\/uploads\/2025\/07\/csm_3T-your-partner-for-electronics-embedded-systems-Kendrion_f5a0ca59ba.jpg\" alt=\"\">\n\t\t\t\t<\/div>\n\t\t\t\t\t\t\n\t\n\t<div class=\"container\">\n\t\t<div class=\"header__content\">\n\t\t\t<div class=\"header__first\">\n\n\t\t\t\t\n\t\t\t\t\n\t\t\t\t\n\t\t\t\t<h1 class=\"header__title\" >\n\t\t\t\t\tMastering Signal and Power Integrity \u2013 with ANSYS-Based Simulation\t\t\t\t<\/h1>\n\n\t\t\t\t<div class=\"header__dots-line\">\n\t\t\t\t\t<svg width=\"431\" height=\"9\" viewbox=\"0 0 431 9\" fill=\"none\" xmlns=\"http:\/\/www.w3.org\/2000\/svg\"><path d=\"M430.799 4.192a1.136 1.136 0 1 1-2.272-.001 1.136 1.136 0 0 1 2.272 0Zm-27.272 0a1.135 1.135 0 1 1-2.27 0 1.135 1.135 0 0 1 2.27 0Zm-27.27 0a1.136 1.136 0 1 1-2.272-.001 1.136 1.136 0 0 1 2.272 0Zm-27.272 0a1.39 1.39 0 1 1-2.78 0 1.39 1.39 0 0 1 2.78 0Zm-27.78 0a1.645 1.645 0 1 1-3.29 0 1.645 1.645 0 0 1 3.29 0Zm-28.29 0a1.9 1.9 0 1 1-3.799 0 1.9 1.9 0 0 1 3.799 0Zm-28.799 0a2.154 2.154 0 1 1-4.308 0 2.154 2.154 0 0 1 4.308 0Zm-29.308 0a2.41 2.41 0 1 1-4.819 0 2.41 2.41 0 0 1 4.819 0Zm-29.819 0a2.663 2.663 0 1 1-5.326.001 2.663 2.663 0 0 1 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\/>\t\t\t\t\t\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t\t\n\t\t\t\t\t\n\t\t\t\t\t\n\t\t\t\t<\/div>\n\t\t\t\n\t\t<\/div>\n\t<\/div>\n<\/header>\n\n\t<div class=\"header__meta\">\n\t<div class=\"container\">\n\t\t<div class=\"header__meta__category\">\n\n\t\t\t\t\t\t\t<div class=\"header__meta__detail\">\n\t\t\t\t\t<div>Branch<\/div>\n\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t<a href=\"https:\/\/fhi.nl\/en\/kennishub\/?_branches_kennishub=industriele-elektronica\" class=\"header__meta__detail--branch\">\n\t\t\t\t\t\t\t\tIndustrial Electronics\t\t\t\t\t\t\t<\/a>\n\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\n\t\t\t\t\t\t\t<div class=\"header__meta__detail\">\n\t\t\t\t\t<div>Subject<\/div>\n\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t<a href=\"https:\/\/fhi.nl\/en\/kennishub\/?_onderwerp_kennishub=design-embedded\" class=\"header__meta__detail--categorie\">\n\t\t\t\t\t\t\t\tDesign &amp; Embedded\t\t\t\t\t\t\t<\/a>\n\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t<a href=\"https:\/\/fhi.nl\/en\/kennishub\/?_onderwerp_kennishub=industriele-elektronica\" class=\"header__meta__detail--categorie\">\n\t\t\t\t\t\t\t\tIndustrial Electronics\t\t\t\t\t\t\t<\/a>\n\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\n\t\t<\/div>\n\t<\/div>\n<\/div>\n\n<div class=\"text bg--white\">\n\t<div class=\"container\">\n\t\t\t\t\t\t\t\t\t\t\t<div class=\"text__content text__content--1-col\">\n\t\t\t<p class=\"text--lg\">In today&#039;s electronics development, performance requirements are more demanding than ever.  High-speed data channels, low-voltage components, and dense layouts push the limits of traditional design approaches.<br \/>At 3T, we meet these challenges head-on with advanced simulations powered by ANSYS \u2013 ensuring signal and power integrity (SI\/PI) from the very first design iteration.<\/p>\r\n<p class=\"text--lg\">\u00a0<\/p>\r\n<h4 id=\"blog-quicklinks-31892-0\" class=\"quicklink__heading\">Why SI\/PI Matters in Modern PCB Design<\/h4>\r\n<p class=\"text--lg\">Modern PCAs (Printed Circuit Assemblies) often include high-speed signals and tightly packed components. This makes them vulnerable to issues such as crosstalk, voltage drop, or impedance mismatches \u2013 problems that may not appear until late in development unless simulations are used early on.<\/p>\r\n<p class=\"text--lg\">By simulating signal and power behavior before a physical prototype exists, we can predict \u2013 and avoid \u2013 potential performance issues. That&#039;s where ANSYS comes in.<br \/>\u00a0<\/p>\r\n<h4 id=\"blog-quicklinks-31892-1\" class=\"quicklink__heading\">From Virtual Model to Optimized Design<\/h4>\r\n<p class=\"text--lg\">Using ANSYS, we model the electronic behavior of critical subsystems to validate and improve our designs. Two main types of analyzes are typically used:<\/p>\r\n<ul data-start=\"1494\" data-end=\"2032\">\r\n<li data-start=\"1494\" data-end=\"1757\">\r\n<p class=\"text--lg\" data-start=\"1496\" data-end=\"1757\"><strong data-start=\"1496\" data-end=\"1532\">Signal Integrity (SI) Simulation<\/strong><br \/>We identify unwanted effects like crosstalk and reflections in high-speed nets. By adjusting driver configurations or rerouting traces, we can drastically reduce noise and ensure clean, reliable signals across the board.<\/p>\r\n<\/li>\r\n<li data-start=\"1759\" data-end=\"2032\">\r\n<p class=\"text--lg\" data-start=\"1761\" data-end=\"2032\"><strong data-start=\"1761\" data-end=\"1796\">Power Integrity (PI) Simulation<\/strong><br \/>Low-voltage components are sensitive to even small fluctuations. PI simulation helps us minimize voltage drops across the power delivery network (PDN), ensuring each component receives the power it needs, consistently and reliably.<\/p>\r\n<p data-start=\"1761\" data-end=\"2032\">\u00a0<\/p>\r\n<\/li>\r\n<\/ul>\r\n<blockquote data-start=\"2034\" data-end=\"2207\">\r\n<p><em data-start=\"2036\" data-end=\"2183\">\u201cWith ANSYS, we can visualize and fix potential issues that would otherwise be invisible until hardware testing \u2013 saving time, and costs, while increasing quality of the end product.\u201d<\/em><\/p>\r\n<\/blockquote>\r\n<p class=\"text--lg\">\u00a0<\/p>\r\n<h4 id=\"blog-quicklinks-31892-2\" class=\"quicklink__heading\">Detecting Problems Before They Appear<\/h4>\r\n<p class=\"text--lg\">For example, by running a voltage ripple simulation between power and ground planes, we can uncover causes of signal degradation. Or, by analyzing crosstalk between adjacent nets, we spot weak points in the layout where small adjustments lead to significant gains in performance.<\/p>\r\n<p class=\"text--lg\">Even subtle design errors \u2013 like an overlooked via or trace proximity \u2013 can be caught in simulation and corrected early.<\/p>\r\n<p class=\"text--lg\">\u00a0<\/p>\r\n<h4 id=\"blog-quicklinks-31892-3\" class=\"quicklink__heading\">Faster Development, Higher Confidence<\/h4>\r\n<p class=\"text--lg\">Simulations reduce the number of physical prototypes required and avoid costly redesigns. This shortens time to market and increases overall product quality. It also gives our customers peace of mind: their design is already optimized before a single PCB is produced.<\/p>\r\n<p class=\"text--lg\">\u00a0<\/p>\r\n<h4 id=\"blog-quicklinks-31892-4\" class=\"quicklink__heading\">More than Just SI\/PI<\/h4>\r\n<p class=\"text--lg\">In addition to signal and power integrity, we use ANSYS to simulate thermal behavior, electromagnetic fields, and mechanical effects. This allows us to provide a holistic design service that meets demanding performance and compliance requirements.<\/p>\r\n<p class=\"text--lg\">\u00a0<\/p>\r\n<h4><strong data-start=\"3263\" data-end=\"3301\">Facing a Complex Design Challenge?<\/strong><\/h4>\r\n<p class=\"text--lg\">At 3T, we&#039;re ready to tackle your toughest design problems using the power of simulation. With deep experience in electronics development and ANSYS tools, we help you get it right from the start.<\/p>\r\n<p class=\"text--lg\"><strong data-start=\"3500\" data-end=\"3553\">Let&#039;s turn complexity into confidence \u2013 together.<\/strong><br \/>\u00a0<\/p>\t\t<\/div>\n\t<\/div>\n<\/div>\r\n\t<div class=\"articles bg--offwhite automatic\">\r\n\t\t<div class=\"container\">\r\n\t\t\t<div class=\"articles__header\">\r\n\t\t\t\t\t\t\t\t\t<div class='heading-wrapper'><svg width=\"13\" height=\"13\" viewbox=\"0 0 13 13\" fill=\"none\" xmlns=\"http:\/\/www.w3.org\/2000\/svg\"><circle cx=\"6.394\" cy=\"6.5\" r=\"6.394\" fill=\"#000\"\/><\/svg><h2>Related articles<\/h2><\/div>\t\t\t\t\t\t\t\t\t\t\t\t\t<a href=\"\/en\/profiel\/kendrion-3t\/\" class=\"button button--outline\">view profile<\/a>\r\n\t\t\t\t\t\t\t<\/div>\r\n\t\t\t\t\t\t<div class=\"post-grid post-grid--no-padding\">\r\n\t\t\t\t\n<a class=\"single-item single-item__articles\" href=\"https:\/\/fhi.nl\/en\/news\/lumineq-see-through-display-brings-dynamic-information-to-line-of-sight\/\" data-id=\"32943\">\n\t<div class=\"single-item__articles-icon\">\n\t\t<svg width=\"103\" height=\"103\" viewbox=\"0 0 103 103\" fill=\"none\" xmlns=\"http:\/\/www.w3.org\/2000\/svg\">\n<path fill-rule=\"evenodd\" clip-rule=\"evenodd\" d=\"M49.5 98.9587V82.3076C33.3844 81.2758 20.6328 67.878 20.6328 51.5019C20.6328 35.1258 33.3844 21.728 49.5 20.6962V4.04134C24.1941 5.08952 4 25.9365 4 51.5C4 77.0635 24.1941 97.9105 49.5 98.9587ZM53.5 78.2983V61.8096H76.3238C72.5238 70.9498 63.8222 77.5397 53.5 78.2983ZM49.5 78.298V61.8096H26.681C30.4804 70.9484 39.1799 77.5377 49.5 78.298ZM47.0728 57.8096H25.3773C24.8906 55.7865 24.6328 53.6743 24.6328 51.5019C24.6328 37.3358 35.5955 25.7301 49.5 24.7058V37.013H34.0466C33.2709 37.013 32.5653 37.4615 32.2359 38.1637C31.9065 38.8659 32.0128 39.6952 32.5086 40.2916L47.0728 57.8096ZM55.9249 57.8096H77.6274C78.1141 55.7865 78.3719 53.6743 78.3719 51.5019C78.3719 37.3342 67.4068 25.7275 53.5 24.7055V37.013H68.9511C69.7268 37.013 70.4324 37.4615 70.7618 38.1637C71.0912 38.8659 70.9849 39.6952 70.4891 40.2916L55.9249 57.8096ZM53.5 82.3079V98.9587C78.8059 97.9105 99 77.0635 99 51.5C99 25.9365 78.8059 5.08952 53.5 4.04134V20.6959C69.6178 21.7254 82.3719 35.1242 82.3719 51.5019C82.3719 67.8796 69.6178 81.2784 53.5 82.3079ZM0 51.5C0 23.7271 21.9843 1.08883 49.5 0.0381213V0H51.5H53.5V0.0381213C81.0157 1.08883 103 23.7271 103 51.5C103 79.9427 79.9427 103 51.5 103C23.0573 103 0 79.9427 0 51.5ZM38.3102 41.013H64.6875L51.4989 56.8765L38.3102 41.013Z\" fill=\"#2DD881\"\/>\n<\/svg>\n\t<\/div>\n\t<div class=\"single-item__articles-title\"><div class='heading-wrapper'><h3>LUMINEQ see-through display brings dynamic information to line of sight<\/h3><\/div><\/div>\n\t<div class=\"single-item__articles-terms\">\n\t\t\n\t\t\n\t\t\t\t\t\t<span class=\"button button--outline single-item__articles-term--branche single-item__articles-term\">Industrial Electronics<\/span>\n\t\t\t\t\t\t\t\t<span class=\"button button--outline single-item__articles-term--branche single-item__articles-term\">Electronics &amp; Applications<\/span>\n\t\t\t\t\t\t\t\t<span class=\"button button--outline single-item__articles-term--branche single-item__articles-term\">Members content<\/span>\n\t\t\t\t\t<\/div>\n\t<div class=\"single-item__articles-author-date-wrapper\">\n\t\t\t\t\t<div class=\"single-item__articles-author\">\n\t\t\t\tNijkerk Electronics\t\t\t<\/div>\n\t\t\t\t\t\t\t<div class=\"single-item__articles-date\">\n\t\t\t\tAugust 9, 2023\t\t\t<\/div>\n\t\t\t<\/div>\n<\/a>\n\n<a class=\"single-item single-item__articles\" href=\"https:\/\/fhi.nl\/en\/news\/kort-economisch-nieuws-van-3-mei-2021\/\" data-id=\"39106\">\n\t<div class=\"single-item__articles-icon\">\n\t\t<svg width=\"35\" height=\"35\" viewbox=\"0 0 35 35\" fill=\"none\" xmlns=\"http:\/\/www.w3.org\/2000\/svg\">\n<mask id=\"mask0_1182_5532\" style=\"mask-type:luminance\" maskunits=\"userSpaceOnUse\" x=\"0\" y=\"0\" width=\"35\" height=\"35\">\n<path d=\"M0 0H35V35H0V0Z\" fill=\"white\"\/>\n<\/mask>\n<g mask=\"url(#mask0_1182_5532)\">\n<path d=\"M5.12695 9.22852H1.02539V31.9238H10.4299C12.2868 31.9238 14.0678 32.6615 15.3809 33.9746H19.6191C20.9322 32.6615 22.7132 31.9238 24.5701 31.9238H33.9746V11.2793H29.873\" stroke=\"#2A5CEE\" stroke-width=\"2\" stroke-miterlimit=\"10\"\/>\n<path d=\"M17.5 9.22852H18.1426C20.0088 7.89544 22.2237 7.17773 24.5615 7.17773H29.873V27.8223H24.5615C22.2237 27.8223 20.0088 28.54 18.1426 29.873H16.8574C14.9912 28.54 12.7763 27.8223 10.4385 27.8223H5.12695V5.12695H9.22852\" stroke=\"#2A5CEE\" stroke-width=\"2\" stroke-miterlimit=\"10\"\/>\n<path d=\"M9.22852 1.02539V21.6699C13.759 21.6699 17.5 25.3425 17.5 29.873V9.22852C17.5 4.698 13.759 1.02539 9.22852 1.02539Z\" stroke=\"#2A5CEE\" stroke-width=\"2\" stroke-miterlimit=\"10\"\/>\n<\/g>\n<\/svg>\n\t<\/div>\n\t<div class=\"single-item__articles-title\"><div class='heading-wrapper'><h3>Brief economic news of May 3, 2021<\/h3><\/div><\/div>\n\t<div class=\"single-item__articles-terms\">\n\t\t\n\t\t\n\t\t\t\t\t\t<span class=\"button button--outline single-item__articles-term--branche single-item__articles-term\">Federated<\/span>\n\t\t\t\t\t\t\t\t<span class=\"button button--outline single-item__articles-term--branche single-item__articles-term\">Economy<\/span>\n\t\t\t\t\t<\/div>\n\t<div class=\"single-item__articles-author-date-wrapper\">\n\t\t\t\t\t<div class=\"single-item__articles-author\">\n\t\t\t\tFHI, Federation of Technology Industries\t\t\t<\/div>\n\t\t\t\t\t\t\t<div class=\"single-item__articles-date\">\n\t\t\t\tMay 3, 2021\t\t\t<\/div>\n\t\t\t<\/div>\n<\/a>\n\t\t\t<\/div>\r\n\t\t<\/div>\r\n\t<\/div>","protected":false},"excerpt":{"rendered":"<p>Kendrion 3T uses ANSYS based simulation to improve signal and power integrity in modern PCB design. As electronic systems become faster, smaller and more complex, issues such as crosstalk, voltage drops and impedance mismatches can affect performance if they are detected too late in the development process.<\/p>\n<p>By using simulation early in the design phase, Kendrion 3T can identify and solve potential problems before a physical prototype is built. Signal Integrity simulation helps optimize high speed signals and reduce unwanted effects such as reflections and noise. Power Integrity simulation helps ensure that low voltage components receive stable and reliable power across the power delivery network.<\/p>\n<p>The article shows how simulation supports faster development, fewer redesigns and higher product quality. In addition to signal and power integrity, Kendrion 3T also uses ANSYS to simulate thermal behavior, electromagnetic fields and mechanical effects. This creates a more complete design approach for demanding electronics development.<\/p>","protected":false},"featured_media":82912,"template":"","branches":[13],"events":[],"secretariat":[],"categories":[18,57],"themes_tax":[524],"content_types":[514],"class_list":["post-82911","news","type-news","status-publish","has-post-thumbnail","hentry"],"acf":[],"yoast_head":"<!-- This site is optimized with the Yoast SEO plugin v26.8 - https:\/\/yoast.com\/product\/yoast-seo-wordpress\/ -->\n<title>ANSYS Based Simulation for PCB Design<\/title>\n<meta name=\"description\" content=\"Learn how Kendrion 3T uses ANSYS based simulation to improve signal integrity, power integrity and PCB design quality in complex electronics development.\" \/>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/www.kendrion.com\/en\/newsroom\/detail\/blog\/ansys-tooling\" \/>\n<meta property=\"og:locale\" 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