{"id":82911,"date":"2025-07-09T13:56:00","date_gmt":"2025-07-09T11:56:00","guid":{"rendered":"https:\/\/fhi.nl\/nieuws\/mastering-signal-and-power-integrity-with-ansys-based-simulation\/"},"modified":"2026-05-29T14:07:00","modified_gmt":"2026-05-29T12:07:00","slug":"mastering-signal-and-power-integrity-with-ansys-based-simulation","status":"publish","type":"news","link":"https:\/\/fhi.nl\/en\/news\/mastering-signal-and-power-integrity-with-ansys-based-simulation\/","title":{"rendered":"Mastering Signal and Power Integrity \u2013 with ANSYS-Based Simulation"},"content":{"rendered":"<header id=\"header\" class=\"header header--high header--branch\">\n\n\t\t\t\t\t\t\t\t\t\t<div class=\"header__background header__background--high\">\n\t\t\t\t\t<img decoding=\"async\" class=\"header__background-image\" src=\"https:\/\/fhi.nl\/app\/uploads\/2025\/07\/csm_3T-your-partner-for-electronics-embedded-systems-Kendrion_f5a0ca59ba.jpg\" alt=\"\">\n\t\t\t\t<\/div>\n\t\t\t\t\t\t\n\t\n\t<div class=\"container\">\n\t\t<div class=\"header__content\">\n\t\t\t<div class=\"header__first\">\n\n\t\t\t\t\n\t\t\t\t\n\t\t\t\t\n\t\t\t\t<h1 class=\"header__title\" >\n\t\t\t\t\tMastering Signal and Power Integrity \u2013 with ANSYS-Based Simulation\t\t\t\t<\/h1>\n\n\t\t\t\t<div class=\"header__dots-line\">\n\t\t\t\t\t<svg width=\"431\" height=\"9\" viewbox=\"0 0 431 9\" fill=\"none\" xmlns=\"http:\/\/www.w3.org\/2000\/svg\"><path d=\"M430.799 4.192a1.136 1.136 0 1 1-2.272-.001 1.136 1.136 0 0 1 2.272 0Zm-27.272 0a1.135 1.135 0 1 1-2.27 0 1.135 1.135 0 0 1 2.27 0Zm-27.27 0a1.136 1.136 0 1 1-2.272-.001 1.136 1.136 0 0 1 2.272 0Zm-27.272 0a1.39 1.39 0 1 1-2.78 0 1.39 1.39 0 0 1 2.78 0Zm-27.78 0a1.645 1.645 0 1 1-3.29 0 1.645 1.645 0 0 1 3.29 0Zm-28.29 0a1.9 1.9 0 1 1-3.799 0 1.9 1.9 0 0 1 3.799 0Zm-28.799 0a2.154 2.154 0 1 1-4.308 0 2.154 2.154 0 0 1 4.308 0Zm-29.308 0a2.41 2.41 0 1 1-4.819 0 2.41 2.41 0 0 1 4.819 0Zm-29.819 0a2.663 2.663 0 1 1-5.326.001 2.663 2.663 0 0 1 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\/>\t\t\t\t\t\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t\t\n\t\t\t\t\t\n\t\t\t\t\t\n\t\t\t\t<\/div>\n\t\t\t\n\t\t<\/div>\n\t<\/div>\n<\/header>\n\n\t<div class=\"header__meta\">\n\t<div class=\"container\">\n\t\t<div class=\"header__meta__category\">\n\n\t\t\t\t\t\t\t<div class=\"header__meta__detail\">\n\t\t\t\t\t<div>Branch<\/div>\n\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t<a href=\"https:\/\/fhi.nl\/en\/kennishub\/?_branches_kennishub=industriele-elektronica\" class=\"header__meta__detail--branch\">\n\t\t\t\t\t\t\t\tIndustrial Electronics\t\t\t\t\t\t\t<\/a>\n\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\n\t\t\t\t\t\t\t<div class=\"header__meta__detail\">\n\t\t\t\t\t<div>Subject<\/div>\n\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t<a href=\"https:\/\/fhi.nl\/en\/kennishub\/?_onderwerp_kennishub=design-embedded\" class=\"header__meta__detail--categorie\">\n\t\t\t\t\t\t\t\tDesign &amp; Embedded\t\t\t\t\t\t\t<\/a>\n\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t<a href=\"https:\/\/fhi.nl\/en\/kennishub\/?_onderwerp_kennishub=industriele-elektronica\" class=\"header__meta__detail--categorie\">\n\t\t\t\t\t\t\t\tIndustrial Electronics\t\t\t\t\t\t\t<\/a>\n\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\n\t\t<\/div>\n\t<\/div>\n<\/div>\n\n<div class=\"text bg--white\">\n\t<div class=\"container\">\n\t\t\t\t\t\t\t\t\t\t\t<div class=\"text__content text__content--1-col\">\n\t\t\t<p class=\"text--lg\">In today\u2019s electronics development, performance requirements are more demanding than ever. \u00a0High-speed data channels, low-voltage components, and dense layouts push the limits of traditional design approaches.<br \/>At 3T, we meet these challenges head-on with advanced simulations powered by ANSYS \u2013 ensuring signal and power integrity (SI\/PI) from the very first design iteration.<\/p>\r\n<p class=\"text--lg\">\u00a0<\/p>\r\n<h4 id=\"blog-quicklinks-31892-0\" class=\"quicklink__heading\">Why SI\/PI Matters in Modern PCB Design<\/h4>\r\n<p class=\"text--lg\">Modern PCAs (Printed Circuit Assemblies) often include high-speed signals and tightly packed components. This makes them vulnerable to issues such as crosstalk, voltage drop, or impedance mismatches \u2013 problems that may not appear until late in development unless simulations are used early on.<\/p>\r\n<p class=\"text--lg\">By simulating signal and power behavior before a physical prototype exists, we can predict \u2013 and avoid \u2013 potential performance issues. That\u2019s where ANSYS comes in.<br \/>\u00a0<\/p>\r\n<h4 id=\"blog-quicklinks-31892-1\" class=\"quicklink__heading\">From Virtual Model to Optimized Design<\/h4>\r\n<p class=\"text--lg\">Using ANSYS, we model the electronic behavior of critical subsystems to validate and improve our designs. Two main types of analyses are typically used:<\/p>\r\n<ul data-start=\"1494\" data-end=\"2032\">\r\n<li data-start=\"1494\" data-end=\"1757\">\r\n<p class=\"text--lg\" data-start=\"1496\" data-end=\"1757\"><strong data-start=\"1496\" data-end=\"1532\">Signal Integrity (SI) Simulation<\/strong><br \/>We identify unwanted effects like crosstalk and reflections in high-speed nets. By adjusting driver configurations or rerouting traces, we can drastically reduce noise and ensure clean, reliable signals across the board.<\/p>\r\n<\/li>\r\n<li data-start=\"1759\" data-end=\"2032\">\r\n<p class=\"text--lg\" data-start=\"1761\" data-end=\"2032\"><strong data-start=\"1761\" data-end=\"1796\">Power Integrity (PI) Simulation<\/strong><br \/>Low-voltage components are sensitive to even small fluctuations. PI simulation helps us minimize voltage drops across the power delivery network (PDN), ensuring each component receives the power it needs, consistently and reliably.<\/p>\r\n<p data-start=\"1761\" data-end=\"2032\">\u00a0<\/p>\r\n<\/li>\r\n<\/ul>\r\n<blockquote data-start=\"2034\" data-end=\"2207\">\r\n<p><em data-start=\"2036\" data-end=\"2183\">\u201cWith ANSYS, we can visualize and fix potential issues that would otherwise be invisible until hardware testing \u2013 saving time, and costs, while increasing quality of the end product.\u201d<\/em><\/p>\r\n<\/blockquote>\r\n<p class=\"text--lg\">\u00a0<\/p>\r\n<h4 id=\"blog-quicklinks-31892-2\" class=\"quicklink__heading\">Detecting Problems Before They Appear<\/h4>\r\n<p class=\"text--lg\">For example, by running a voltage ripple simulation between power and ground planes, we can uncover causes of signal degradation. Or, by analyzing crosstalk between adjacent nets, we spot weak points in the layout where small adjustments lead to significant gains in performance.<\/p>\r\n<p class=\"text--lg\">Even subtle design errors \u2013 like an overlooked via or trace proximity \u2013 can be caught in simulation and corrected early.<\/p>\r\n<p class=\"text--lg\">\u00a0<\/p>\r\n<h4 id=\"blog-quicklinks-31892-3\" class=\"quicklink__heading\">Faster Development, Higher Confidence<\/h4>\r\n<p class=\"text--lg\">Simulations reduce the number of physical prototypes required and avoid costly redesigns. This shortens time to market and increases overall product quality. It also gives our customers peace of mind: their design is already optimized before a single PCB is produced.<\/p>\r\n<p class=\"text--lg\">\u00a0<\/p>\r\n<h4 id=\"blog-quicklinks-31892-4\" class=\"quicklink__heading\">More than Just SI\/PI<\/h4>\r\n<p class=\"text--lg\">In addition to signal and power integrity, we use ANSYS to simulate thermal behavior, electromagnetic fields, and mechanical effects. This allows us to provide a holistic design service that meets demanding performance and compliance requirements.<\/p>\r\n<p class=\"text--lg\">\u00a0<\/p>\r\n<h4><strong data-start=\"3263\" data-end=\"3301\">Facing a Complex Design Challenge?<\/strong><\/h4>\r\n<p class=\"text--lg\">At 3T, we\u2019re ready to tackle your toughest design problems using the power of simulation. With deep experience in electronics development and ANSYS tools, we help you get it right from the start.<\/p>\r\n<p class=\"text--lg\"><strong data-start=\"3500\" data-end=\"3553\">Let\u2019s turn complexity into confidence \u2013 together.<\/strong><br \/>\u00a0<\/p>\t\t<\/div>\n\t<\/div>\n<\/div>\r\n\t<div class=\"articles bg--offwhite automatic\">\r\n\t\t<div class=\"container\">\r\n\t\t\t<div class=\"articles__header\">\r\n\t\t\t\t\t\t\t\t\t<div class='heading-wrapper'><svg width=\"13\" height=\"13\" viewbox=\"0 0 13 13\" fill=\"none\" xmlns=\"http:\/\/www.w3.org\/2000\/svg\"><circle cx=\"6.394\" cy=\"6.5\" r=\"6.394\" fill=\"#000\"\/><\/svg><h2>Related articles<\/h2><\/div>\t\t\t\t\t\t\t\t\t\t\t\t\t<a href=\"\/en\/profiel\/kendrion-3t\/\" class=\"button button--outline\">view profile<\/a>\r\n\t\t\t\t\t\t\t<\/div>\r\n\t\t\t\t\t\t<div class=\"post-grid post-grid--no-padding\">\r\n\t\t\t\t\n<a class=\"single-item single-item__articles\" href=\"https:\/\/fhi.nl\/en\/news\/financial-year-2025\/\" data-id=\"81983\">\n\t<div class=\"single-item__articles-icon\">\n\t\t<svg width=\"35\" height=\"35\" viewbox=\"0 0 35 35\" fill=\"none\" xmlns=\"http:\/\/www.w3.org\/2000\/svg\">\n<mask id=\"mask0_1182_5532\" style=\"mask-type:luminance\" maskunits=\"userSpaceOnUse\" x=\"0\" y=\"0\" width=\"35\" height=\"35\">\n<path d=\"M0 0H35V35H0V0Z\" fill=\"white\"\/>\n<\/mask>\n<g mask=\"url(#mask0_1182_5532)\">\n<path d=\"M5.12695 9.22852H1.02539V31.9238H10.4299C12.2868 31.9238 14.0678 32.6615 15.3809 33.9746H19.6191C20.9322 32.6615 22.7132 31.9238 24.5701 31.9238H33.9746V11.2793H29.873\" stroke=\"#2A5CEE\" stroke-width=\"2\" stroke-miterlimit=\"10\"\/>\n<path d=\"M17.5 9.22852H18.1426C20.0088 7.89544 22.2237 7.17773 24.5615 7.17773H29.873V27.8223H24.5615C22.2237 27.8223 20.0088 28.54 18.1426 29.873H16.8574C14.9912 28.54 12.7763 27.8223 10.4385 27.8223H5.12695V5.12695H9.22852\" stroke=\"#2A5CEE\" stroke-width=\"2\" stroke-miterlimit=\"10\"\/>\n<path d=\"M9.22852 1.02539V21.6699C13.759 21.6699 17.5 25.3425 17.5 29.873V9.22852C17.5 4.698 13.759 1.02539 9.22852 1.02539Z\" stroke=\"#2A5CEE\" stroke-width=\"2\" stroke-miterlimit=\"10\"\/>\n<\/g>\n<\/svg>\n\t<\/div>\n\t<div class=\"single-item__articles-title\"><div class='heading-wrapper'><h3>Financial year 2025<\/h3><\/div><\/div>\n\t<div class=\"single-item__articles-terms\">\n\t\t\n\t\t\n\t\t\t<\/div>\n\t<div class=\"single-item__articles-author-date-wrapper\">\n\t\t\t\t\t<div class=\"single-item__articles-author\">\n\t\t\t\tGreiner Bio-One BV\t\t\t<\/div>\n\t\t\t\t\t\t\t<div class=\"single-item__articles-date\">\n\t\t\t\t6 May 2026\t\t\t<\/div>\n\t\t\t<\/div>\n<\/a>\n\n<a class=\"single-item single-item__articles\" href=\"https:\/\/fhi.nl\/en\/news\/kort-economisch-nieuws-van-14-december-2021\/\" data-id=\"37284\">\n\t<div class=\"single-item__articles-icon\">\n\t\t<svg width=\"35\" height=\"35\" viewbox=\"0 0 35 35\" fill=\"none\" xmlns=\"http:\/\/www.w3.org\/2000\/svg\">\n<mask id=\"mask0_1182_5532\" style=\"mask-type:luminance\" maskunits=\"userSpaceOnUse\" x=\"0\" y=\"0\" width=\"35\" height=\"35\">\n<path d=\"M0 0H35V35H0V0Z\" fill=\"white\"\/>\n<\/mask>\n<g mask=\"url(#mask0_1182_5532)\">\n<path d=\"M5.12695 9.22852H1.02539V31.9238H10.4299C12.2868 31.9238 14.0678 32.6615 15.3809 33.9746H19.6191C20.9322 32.6615 22.7132 31.9238 24.5701 31.9238H33.9746V11.2793H29.873\" stroke=\"#2A5CEE\" stroke-width=\"2\" stroke-miterlimit=\"10\"\/>\n<path d=\"M17.5 9.22852H18.1426C20.0088 7.89544 22.2237 7.17773 24.5615 7.17773H29.873V27.8223H24.5615C22.2237 27.8223 20.0088 28.54 18.1426 29.873H16.8574C14.9912 28.54 12.7763 27.8223 10.4385 27.8223H5.12695V5.12695H9.22852\" stroke=\"#2A5CEE\" stroke-width=\"2\" stroke-miterlimit=\"10\"\/>\n<path d=\"M9.22852 1.02539V21.6699C13.759 21.6699 17.5 25.3425 17.5 29.873V9.22852C17.5 4.698 13.759 1.02539 9.22852 1.02539Z\" stroke=\"#2A5CEE\" stroke-width=\"2\" stroke-miterlimit=\"10\"\/>\n<\/g>\n<\/svg>\n\t<\/div>\n\t<div class=\"single-item__articles-title\"><div class='heading-wrapper'><h3>Brief economic news of December 14, 2021<\/h3><\/div><\/div>\n\t<div class=\"single-item__articles-terms\">\n\t\t\n\t\t\n\t\t\t\t\t\t<span class=\"button button--outline single-item__articles-term--branche single-item__articles-term\">Federated<\/span>\n\t\t\t\t\t\t\t\t<span class=\"button button--outline single-item__articles-term--branche single-item__articles-term\">Economy<\/span>\n\t\t\t\t\t<\/div>\n\t<div class=\"single-item__articles-author-date-wrapper\">\n\t\t\t\t\t<div class=\"single-item__articles-author\">\n\t\t\t\tFHI, Federation of Technology Industries\t\t\t<\/div>\n\t\t\t\t\t\t\t<div class=\"single-item__articles-date\">\n\t\t\t\tDecember 14, 2021\t\t\t<\/div>\n\t\t\t<\/div>\n<\/a>\n\t\t\t<\/div>\r\n\t\t<\/div>\r\n\t<\/div>","protected":false},"excerpt":{"rendered":"<p>Kendrion 3T uses ANSYS based simulation to improve signal and power integrity in modern PCB design. As electronic systems become faster, smaller and more complex, issues such as crosstalk, voltage drops and impedance mismatches can affect performance if they are detected too late in the development process.<\/p>\n<p>By using simulation early in the design phase, Kendrion 3T can identify and solve potential problems before a physical prototype is built. Signal Integrity simulation helps optimize high speed signals and reduce unwanted effects such as reflections and noise. Power Integrity simulation helps ensure that low voltage components receive stable and reliable power across the power delivery network.<\/p>\n<p>The article shows how simulation supports faster development, fewer redesigns and higher product quality. In addition to signal and power integrity, Kendrion 3T also uses ANSYS to simulate thermal behavior, electromagnetic fields and mechanical effects. This creates a more complete design approach for demanding electronics development.<\/p>","protected":false},"featured_media":82912,"template":"","branches":[13],"events":[],"secretariat":[],"categories":[18,57],"themes_tax":[524],"content_types":[514],"class_list":["post-82911","news","type-news","status-publish","has-post-thumbnail","hentry"],"acf":[],"yoast_head":"<!-- This site is optimized with the Yoast SEO plugin v26.8 - https:\/\/yoast.com\/product\/yoast-seo-wordpress\/ -->\n<title>ANSYS Based Simulation for PCB Design<\/title>\n<meta name=\"description\" content=\"Learn how Kendrion 3T uses ANSYS based simulation to improve signal integrity, power integrity and PCB design quality in complex electronics development.\" \/>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/www.kendrion.com\/en\/newsroom\/detail\/blog\/ansys-tooling\" \/>\n<meta property=\"og:locale\" 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