The market of wireless devices continues to grow very rapidly. Today, as the Internet-of-Things is getting closer to a daily life reality, a whole new era of devices communicating wirelessly is taking place in the very near future. Wireless communication depends on RF technologies that have specific requirements at different technology levels, starting from substrates on which devices and circuits are developed. The Silicon-on-Insulator (SOI) technology is a rapidly rising candidate technology to accommodate these requirements for RF applications. Every smart phone today contains at least one circuit built on SOI technology and the migration towards SOI keeps growing everyday. Also, these requirements and characteristics need to be measured, validated and improved. Traditional characterization techniques are not satisfactory any more and a need has emerged for new and innovative characterization approaches that meet increasing industry requirements in terms of operation frequency and power. Quality, precision and rapidity of tests are also critical for the time-to-market industrial cycle. This talk addresses both the advantages of the SOI technology for RF and wireless communication and also the new techniques to characterize the new-engineered Si-based substrates targeting the continuously growing wireless market.
Jean-Pierre Raskin, EPL, on behalf of Electro Rent Europe