This talk will discuss a new communication concept that uses mm-wave CMOS chip, on-chip or in-package antennas, and plastic fibers to achieve a reliable and robust GBps communication link. The mm-wave CMOS chip transmit and receives mm-wave radiosignals that propagate through the polymer fiber with low attentuation.
Compared to copper wireline, the proposed solution is far more robust agains EMI. In comparison with optical fibre, the proposed solution has higher mechanical tolerances. Therefore, the RF-through-Plastics concept is ideally suited for GBps robust automotive communication and high-speed consumer products.
Prof. Dr. Ir. Ing. Patrick Reynaert (KU Leuven, ESAT-MICAS)