|09.30 – 10.00
|10.00 – 10.30
|Millimeter wave chip design in Silicon: challenges and opportunities
Speaker: dr. ir. Wouter Steyaert, Tusk IC
5G, radars for self-driving cars, wireless Gbps communication using 60GHz, … These are some of the many emerging technologies and applications that will strongly rely on millimeter waves (30GHz – 300GHz). To bring these applications from the lab into the hands of consumers, integrated circuits operating at these high frequencies are needed.
With the advancements in silicon process technologies, these once unattainable frequencies are now starting to be implemented in mass-production compatible CMOS and SiGe nodes. However, with the increase in frequency from RF to the millimeter wave spectrum comes a new way of looking at and designing these integrated circuits, especially in advanced silicon process nodes.
In this talk, the challenges and possibilities of millimeter wave integrated circuits will be discussed. Previous work from the Tusk IC team members, ranging from 60GHz up to 600GHz, will illustrate that silicon is a prime candidate to support the coming millimeter wave applications.
|10.30 – 11.00
|Benefits of Real-Time versus traditional swept spectrum analysis
Speaker: Boris Adlung (Rigol Technologies) on behalf of AR Benelux
Real time spectrum analysis offers a different way to capture, visualize and measure fast transient RF signals versus a traditional swept spectrum analyzer. What are the measurement capabilities of a Real-Time SA?
What does this technique mean for monitoring your spectrum and characterizing RF Devices? In this presentation we will go into depth of the different measurement techniques with real-time and show a comparison with tradition spectrum analysis.
|11.00 – 11.30
|11.30 – 12.00
|What is RF Record and Playback?
Speaker: Marcus Petry (Tektronix) on behalf of CN Rood
Today’s Real-Time Spectrum Analyzers offer capabilities to capture and record RF data vs. time for playback and analysis. This is extremely helpful if you’re trying to find the proverbial “signal needle” in the haystack. This presentation discusses the solutions available to you, to help you find your signal of interest faster.
|12.00 – 12.30
|Radio Interference detection and mitigation
Speaker: Ferdinand Gerhardes, Anritsu
As our lives become filled with technology, the likelihood of electronic interference increases. Every lamp dimmer, garage door opener or other new technical “toy” contributes to the electrical noise around us. Many of these devices also “listen” to that growing noise and may react unpredictably to their electronic neighbors, including. Radio Interference is the term used to describe a range of different situations in which transmissions other than those from authorized users of a radio frequency interfere with other radio reception.
In the course of this presentation Anritsu will briefly present possible solutions that help to mitigate interference situation by ‘hunting’ the root cause. We will present typical handheld Spectrum Analyzer solutions, the sophisticated Mobile Interference Hunter approach as well as Spectrum Monitoring and geolocation of harmful transmitters. A brief excurse about indoor and outdoor radio frequency coverage mapping will close the session.
|12.30 – 13.30
|13.30 – 14.00
|Unexpected applications of microwave VNA technology
Speaker: TBC, Rohde & Schwarz
Rohde & Schwarz, known for innovation power in advanced test & measurement equipment, has used their knowledge to enter surprising applications.
Making use of sophisticated network analyzer technologies in the 70-80 GHz frequency range, a next generation security scanner has been developed which improves the speed and reliability of scanning persons at security gates at e.g. airports, concert halls, embassies, etc. The same technology is used to test the performance and radiation pattern of radome’s and bumper’s in automotive radar applications.
This presentation gives you an inside how this microwave technology is implemented for detection of all types of potential dangerous objects e.g. metal, ceramics, plastic, etc.
|14.00 – 14.30
|Thin Film approach to miniaturization of RF and microwave filters
Speaker: Andrew Stringer, Microwave Products Group (MPG) on behalf of Heynen
The history of advances in the development of RF and microwave filters is well documented, and broad innovation goals have remained essentially the same over decades. Better performance, smaller size, lower cost and greater power handling are some of the general ‘wants’ engineers are always working to achieve. However, certain observations about recent industry trends can be made. For instance, material advances and ever-increasing electromagnetic simulation speeds and capabilities have spurred filter innovation in the last 10 years. Accordingly, Lumped component products are supporting higher power handling in smaller packages with little loss in Q.
|14.30 – 15.00
|15.00 – 15.30
|NEX10™ low PIM coaxial interface – Meeting the demands of 5G networks
Speaker: Benoit Dupeux, Radiall
Radiall’s NEX10™ series is a miniature and lightweight RF Coaxial connector with excellent intermodulation performance for outdoor telecom applications up to 20 GHz.
Growing demand for new generation equipment within the Telecom market requires a top performance solution with exceptional benefits and features. To develop this solution, Radiall has partnered with two leading RF connector manufacturers to develop a new compact extremely robust Low PIM connector: NEX10™.
With exceptional performance up to 20 GHz in order to meet the performance needs of customers, NEX10™ also features a compact design which is 50% smaller than 4.3-10. This unique solution also offers separation of electrical and mechanical reference planes, which maximizes intermodulation performance under statique, dynamic, vibrations and torque stress conditions.
|15.30 – 16.00
|High Performance RF Probes – Tackling 5G
Speaker: Dominik Boehler, INGUN
With the first implementable standard recently defined by 3GPP and its first showcase already in place, 5G is becoming a commercial reality. It is expected to profoundly revolutionise the utilisation of sub-6 GHz band and adapt millimetre waves for use in mobile communication. Reliable testing of devices which feature 5G, or any other related technologies, is indispensable. As a result, carefully designed test probes will be required to fulfil the flexible testing demands 5G poses. Typical testing challenges and design issues associated with these high performance probes will be explored.
|16.00 – 17.00