Grounding measures for low frequency noise

Effective Utilization of Metal Spring Materials (On-board Contacts)

As electronic devices become more compact and densely integrated, the reduced distances between components and traces have made it a common problem for noise from power circuits to couple with control circuits, and vice versa. This significantly degrades EMC performance. An effective countermeasure to this issue is to apply shielding to each circuit block to suppress this noise coupling.

In this study, we present an effective method for suppressing noise coupling from power circuits, specifically in the low-frequency range of 10 kHz to 30 MHz. Based on our experimental results, we demonstrate how to achieve effective separation by grounding the metal enclosure and the board ground using metal spring materials.

Eric Ekkapon-san – Kitagawa on behalf of Telerex

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