Texim Europe (E&A fair, stand 7C085) provides the the next SBC series from AAEON Technologies. This SBC is a powerful, versatile solution for advanced industrial Edge AI applications. Equipped with the latest Intel and AMD CPUs and GPUs, they are designed to handle demanding tasks such as real-time image and video processing, machine learning and industrial automation. Thanks to their unprecedented small dimensions (86x55mm) and extensive set of I/O ports, they are easy to integrate and ideal for drone, robotics, smart transportation and other applications.
the next SBC with Intel® Core™ i-level CPU
The next-TGU8 is equipped with the 11th Gen Intel Core i7/i5/i3/Celeron, with up to 4 cores and 8 threads. The efficiency of these CPUs, which clock in at 4.4 GHz, helps to achieve a TDP of up to 28W. In addition to these powerful CPUs, the SBCs come with up to 16GB of onboard LPDDR4x memory and an M.2 2280 M-Key (PCIe x2) to enable expansion with AI acceleration, WiFi and 4G modules.
For more advanced graphics options, paired with Intel® UHD Graphics, or additional storage, an FPC slot for PCIe x4 Gen 3 with Riser kit is available.
Despite its small size, the next-TGU8 does not compromise on I/O. It is equipped with a 2.5GbE and 1 GbE RJ45, two USB 3.2 Gen2 and four USB 2.0 slots, an HDMI 1.4b and eDP display interface.
the next SBC with AMD based SBC
The next-V2K8 is equipped with an AMD Ryzen V2000 processor, currently available with AMD Ryzen Embedded V2718 and V2516 SoCs, with 8 cores and 16 threads, Zen2 x86 architecture and integrated AMD Radeon™ Graphics. The maximum TDP is 25W. This SBC also comes with max. 16GB of onboard LPDDR4x memory, M.2 2280 M-Key (PCIe x2) and the same set of extensive I/Os as the next-TGU8.
Both series come with a variety of memory and storage options, allowing large amounts of data to be stored and processed on-site.
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