Targeted heat distribution at thermal hotspots through vapor chambers

In compact electronics and power electronics, thermal performance is often limited by local hot spots rather than overall dissipation capacity. Where an aluminum heat sink alone falls short, ThermSpread from Seifert Electronic offers an alternative for effective 2D heat distribution in heat sinks.

ThermSpread is a variation on a so-called vapor chamber and consists of aluminum profiles filled with acetone that, through phase transition, rapidly distribute heat over a larger surface. The elements are typically bonded to the base plate of a heat sink, directly beneath thermally critical components. This allows for more efficient utilization of the entire cooling surface.

Thermal conductivity depends on the orientation of the entire unit. The heat source should always be positioned at the bottom for optimal functionality and rapid heat absorption and distribution.

ThermSpread profiles are available in various cross-sections and lengths,

• thickness 1.5 to 6.0 mm
• width 30-185mm
• length 70 to 1000mm 

For mechanically complex designs, bending is possible, and without functional degradation.

This combination of thermal performance and design freedom makes ThermSpread suitable for industrial electronics, power modules and embedded systems with high local heat densities.

The message Targeted heat distribution at thermal hotspots through vapor chambers first appeared on Elincom.

Source: https://www.elincom.nl/nieuws/gerichte-warmteverdeling-bij-thermische-hotspots-door-vapor-chambers/