For engineers seeking an efficient, reliable, low-pressure thermal interface, Leader Tech offers a remarkable innovation with the TCI series. These thin, silver-colored foils consist of a special indium composite that liquefies at 80°C, perfectly adapting to imperfections between components and the heat sink. At room temperature, the material returns to its solid state, ensuring stability and reusability.
Thanks to its high thermal conductivity in all directions and extremely low thermal resistance, this material is ideally suited for high-power density applications such as high-performance CPU/GPU/APUs on graphics cards or in embedded systems and telecom equipment.
Specifications:
- Thermal conductivity ≥ 80 W/m·K in all directions
- Thermal resistance ≤ 0.004 °C·cm²/W at 3.5 bar
- Operating temperature: –50 °C to +500 °C
- Thickness: 0.2 and 0.5 mm
- Size: 150 × 150 mm
- Density: 7.3 g/cm³
- Electrical resistance: 8.4 × 10⁻⁸ Ω·m
The TCI series is ideal for OEMs and developers who want to control thermal issues without applying pressure or mechanical stress to their components.
EEMC can die-cut the sheet material into the desired shape according to customer specifications.
Nederlands