BOPLA's BoVersa series is a modular enclosure system that combines functionality, thermal design, and industrial design in a single platform. The series is designed for IoT, embedded, and wireless systems where mechanical flexibility and heat dissipation are key.
BoVersa is constructed according to a three-part concept: a base, a functional lid, and a design cover. This allows enclosures to be easily configured for a variety of applications.
The base is available in high-quality polycarbonate (PC, UL94-V0) or as an aluminum base, which functions directly as a heat sink for power electronics. This integrated cooling function often eliminates the need for an external heatsink, without compromising aesthetics.
The functional covers are available in closed, transparent, or translucent versions, suitable for displays, status lights, or light guides. BoVersa is available in various sizes and heights and can be used as a wall-mounted, mast-mounted, tabletop, or handheld enclosure.
As is customary with Bopla, the enclosures can be mechanically processed at the factory, fitted with cable entries, display openings and printing, which simplifies integration into series applications.
The message Modular housing with integrated cooling solution first appeared on Elincom.
Source: https://www.elincom.nl/nieuws/modulaire-behuizing-met-geintegreerde-koeloplossing/
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