Optimal EMC sealing with Form-in-Place gaskets

In high-tech electronics such as aerospace, defense, telecom and semiconductor industries, reliable EMC sealing is essential. Parker Chomerics is a global leader in the development of thermal interface and electrically conductive compounds, including high-performance Form-in-Place (FIP) seals or gaskets.

The so-called seals or beads are often applied automatically with a robot dispenser in widths varying from 0.46 mm to 1.57 mm. 

With CHO-FORM, Chomerics offers a product series of electrically conductive FIP material that is characterized by the consistently high quality and reliability of the seals and is therefore prescribed for many high-tech applications.

There are several selection criteria:

• EMC shielding properties 
• Corrosion resistance (also galvanic)
• Temperature resistance
• Hardness / resilience in hardened state
• Shear force or adhesive force on the substrate
• Degree of outgassing
• Free space for the gasket (width)
• Costs

This can result in a base material consisting of one or two components that hardens in an oven or in the open air, with or without a silicone base as a carrier.

EEMC is the specialist factory distributor and can advise on both the choice of material, but also the physical application of the FIP gasket, complete with measurement reports and, if necessary, the packaging of the finished product.