Romex at the D&E event.

What can you expect at Romex
at the D&E Event 2023

Live Demo in our booth.
“Soldering with IoT support”

Integration with Industry 4.0 for maximum connectivity and full traceability of your soldering process

In this demo we show how we have full control over the soldering or desoldering process with the new Weller WXsmart. All factors that are important for every soldered connection that is made are stored, including the date and time, operator, used and connected Weller equipment, used bolt, used tip, set and measured soldering temperature, max/min, soldering time, condition of the connected extraction, etc. .
This data is easily stored on a computer or in a network and can be integrated into your existing ERP system.

Video impression: Soldering with traceability (industry 4.0).

Romex Presentation during the D&E event 2023:

What is the influence of incorrectly designing a PCB on, among other things, assembly and test coverage?

This contribution starts with an answer to the question; “Nowadays, with a highly automated assembly and manufacturing process with modern inspection systems, we still need to test the product electrically.” 
During the production of electronics, it is important, for a cost-efficient and high-quality end product, that inspections are carried out between each production and assembly step in the process.
Only in this way can production errors that arise from the previous production step be prevented from being carried over to the next production step.
This is the only way to prevent production errors from accumulating during manufacturing and assembly and from repairing these production errors at the end of the production line becoming a costly, time-consuming and complex matter.
If the above basic rules have been met and your product has been treated with the utmost care (especially considering ESD safety), the produced product will contain as small a percentage as possible of errors caused by production.

However, during the final assembly step, the reflow soldering of the components on the printed circuit board, unfortunately all kinds of things can still go wrong, such as the occurrence of closures and "opens" in components that are not, or not properly, soldered together. with possible errors that were “missed” during the inspection steps earlier in the process, such as missing, incorrectly or incorrectly placed components, for example.
Unfortunately, these errors are very difficult to recognize and identify with visual inspection, whether or not automatically. This requires a different approach, namely electrical testing of your product.

During this presentation, Peter van Oostrom will discuss the following topics;

• Why are we actually testing a just-assembled PCB?
• How important is good design for a reliable production process.
• What automatic testing methods are available?
• How does a modular test system basically work?
• The benefits of a Mass Interconnect Interface.
• Pitfalls when developing a test system and solutions.
• How do we make good and reliable contact between the DUT and measuring electronics.
• Most important DFT guidelines that every developer should know.
• Everything together in one good system, examples and solutions

If you have any questions about the above information, please take a moment
contact Romex BV by email or use ours contact page.