The ultimate liquid dispensable gap filler with excellent thermal conductivity – Tputty™ 910

When it comes to ensuring reliable thermal performance for high-performance components, look no further than Laird™ Tputty™ 910. This new gap filler solution offers the lowest thermal resistance and highest thermal reliability on the market. Designed as a one-part liquid with exceptional thermal conductivity, Tputty™ 910 minimizes stress on sensitive components, making it the perfect choice for critical applications.

Effortlessly reduce heat in your high-performance systems with Tputty™ 910. This versatile gap filler is ideal for filling small and medium-sized gaps in a variety of applications, such as automotive multi-domain controllers, servers, telecom base stations, graphics chips and microprocessors.

Key features of Tputty™ 910:

• Thermal conductivity: 9.1W/mK, for efficient heat transfer
• Dispensable and compliant, for easy application and use
• Easy to edit for added convenience and flexibility
• Excellent vertical stability for optimal performance in any orientation
• Low bondline thickness (as low as 180 µm) for improved thermal efficiency
• Minimal outgassing, maintaining a clean and reliable environment
• Complies with ROHS and REACH guidelines

The Tputty™ 910 is suitable for various thermal challenges, as it can handle an impressive temperature range from -40°C to 180°C. With a density of 3.2 g/cc it offers significant thermal performance in a lightweight package.

When you need an advanced, reliable and highly efficient gap filler to address thermal challenges, Tputty™ 910 is the ultimate solution. Experience the power of excellent thermal conductivity and unparalleled performance for your high-performance applications.