In such cases, a fixed thermal path offers a reproducible interface with predictable thermal resistance and without additional process complexity.
Parker Chomerics therefore introduces THERM-A-GAP PAD 10: an extremely compliant and soft gap filler with a hardness of 35 Shore 00 and an excellent thermal conductivity of 1.0 W/m·K. The material effectively absorbs height differences and minimizes contact resistance without high mechanical stress on PCBs, solder joints, or power modules. Thanks to the fixed thickness and mechanical stability, the thermal interface remains consistent, even under vibration and thermal cycles, ensuring reliable heat transfer throughout its lifespan.
Most important features:
- Hardness: 35 Shore 00
- Thermal conductivity: 1.0 W/m·K
- Low clamping force required
- High surface compliance
- UL 94 V-0 classification
Parker Chomerics PAD 10 is available in standard sheet sizes, various thicknesses, and as a die-cut or customer-specific configuration for serial integration.