Electronic components are becoming increasingly powerful and smaller, increasing the demands on thermal management. Thermal gap fillers offer a reliable solution: they bridge air gaps and imperfections between heat sources and heat sinks, significantly improving thermal conductivity without the high mechanical pressure required.
Parker Chomerics' new THERM-A-GAP PAD 80 is a high-end gap filler that combines thermal conductivity with low compressive strength and high formability. This makes the material ideal for a wide range of applications, from 5G and telecom equipment to automotive electronics, LED modules, and high-performance systems such as servers.
Main features:
- 8.3 W/m·K thermal conductivity
- Low compression force, ideal for delicate components
- Electrically insulating
- UL 94 V-0 flame retardant
- Temperature range -55 °C to +200 °C
- Meets NASA outgassing requirements
The PAD 80 is available in standard thicknesses from 0.76 to 5.1 mm and can be supplied in sheets or custom-cut pieces. A variety of backings are available, including pen film, fiberglass, aluminum foil, and optionally with a pressure-sensitive adhesive (PSA) for enhanced adhesion and easier installation.
This material combines ease of use with high performance, resulting in a longer lifespan of electronic systems.
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