High performance thermal gap filler for critical electronics

Parker Chomerics has developed THERM-A-GAP PAD 80LO, an advanced thermal gap filler specifically for durable, mission-critical and high-power electronic applications in industries such as high-performance computing, defense, telecommunications and automotive.

With a high thermal conductivity of 8.0 W/m K and exceptionally low silicone oil loss, PAD 80LO provides a durable, reliable solution for environments where traditional silicone based materials can cause long-term problems. 

The unique material properties, including excellent pressure resistance and low compression force, guarantee optimum heat transfer and thus the protection of vulnerable electronic components with an extremely long lifespan. This results in more efficient thermal management and increases the reliability of systems.

Available in sheet or custom cut sizes, PAD 80LO offers a versatile, high-performance solution for demanding applications.