Measuring adhesive thickness with NIR for wood and cardboard production

Increased quality and cost savings  

If you want to measure the glue thickness on wooden plates or cardboard, you use Near Infrared (NIR). NIR extracts information from the absorption of electromagnetic waves (light) in the spectrum with wavelengths from 400 to 2500 nm. When light falls on the product to be bonded, scattering also occurs due to the tissue structures present. Information about the physical quality (determined by structure/texture) can be obtained from these scattering properties. This way you always use the right amount of glue, which ensures higher quality and cost savings.  

If you would like more information, please contact Product Manager and expert in spectroscopy Kees van der Sar, via e-mail or tel. no.: 0162 460404.