Thermal management of electronic components and systems is more challenging than ever. Energy density continues to increase, while product shape factors continue to shrink.
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Engineers should consider thermal management early in the product development cycle to ensure sufficient space and power are available to remove heat from their system. Laird developed liquid cooling systems (LCS). These self-contained units recirculate a refrigerant to a preset temperature. There are two different types of liquid cooling solutions: a liquid heat exchanger system and a compressor-based system. More information about these liquid cooling solutions can be found at Liquide Cooling Systems Laird.
In addition, Mecc.Al has developed a series of different technical proposals for the production of liquid cold plate technology. These different production technologies are applicable to each individual project, as they can be adapted to the specific needs of the project itself. The aim is to always design and deliver the best technical, thermal and economic solution. The Mecc.Al LCP range is divided into 4 different product families, with each product defined according to a different special production technology and at the same time extremely flexible and versatile, adapted to the requirements of the design itself. The materials used are aluminum in various alloys, copper, brass and stainless steel. More information about liquid cold plate technology can be found at MeccAl Liquid Cold Plate Technologies.For more information: info@telerex-europe.com