In high-tech electronics applications such as quantum computing, defense, automotive, medical, and semiconductor industries, efficient heat dissipation is essential to ensure component reliability and longevity. Thermal interface materials (TIMs) form the connection between the heat source and the heat sink.
A proven solution is Therm-a-Gap Gel from Parker Chomerics. This soft, thermally conductive gel fills all microscopic imperfections and guarantees excellent heat transfer at low pressure. Thanks to its thixotropic properties, the material does not flow during application but maintains a stable dot shape.
Precise dispensing is performed using a robotic dispenser that places TIM dots at the required positions. The robot continuously measures the substrate height and automatically adjusts the needle position, ensuring each dot has the same shape and volume. This results in a reproducible process and optimal thermal contact – crucial for chips whose top surfaces make direct contact with a heat sink.
Key Benefits of Therm-a-Gap Gel:
- High thermal conductivity at low pressure
- Low outgassing and high reliability
- Thixotropic behavior: no run-off of dots
- Flexible processing in automated production
The combination of advanced dispensing robotics and high-performance materials such as Therm-a-Gap Gel creates a stable, efficient and scalable solution for thermal management in modern electronics.
EEMC supports material selection and the dispensing process, including validation, measurement reports, and packaging solutions to protect finished products.
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