New ultra-rugged 11th Gen Intel® Core® congatec modules with soldered RAM
New 11th Gen Intel® Core® processor based Computer-on-Modules with soldered RAM for highest shock and vibration resistance from congatec. Designed to withstand even extreme temperature ranges from -40°C to +85°C, the new COM Express Type 6 Computer-on-Modules provide full compliance for shock and vibration resistant operation in challenging transportation and mobility applications. For more price sensitive applications, congatec also offers a cost optimized Intel® Celeron® processor based variant for the extended temperature range from 0°C to 60°C. Typical customers for the new range of Computer-on-Modules based on the Tiger Lake microarchitecture are OEMs of trains, commercial vehicles, construction machines, agricultural vehicles, self-driving robots and many other mobile applications in the most challenging outdoor and off-road environments. Shock and vibration resistant stationary devices are another important application area as digitization requires critical infrastructure protection (CIP) against earthquakes and other mission critical events. All these applications can now benefit from super-fast LPDDR4X RAM with up to 4266 MT/s and in-band error-correcting code (IBECC) for single failure tolerance and high data transmission quality in EMI critical environments.
More information
Features:
- Embedded/Industrial use condition
- Extended temperature options available
- PCI Express Gen 4
- Up to 32 GByte dual channel LPDDR4X soldered down memory with 4266 MT/ s IBECC
- AI/DL Instruction Sets including VNNI
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