Silicone-free Thermal Fillers Tflex SF4 – Tflex SF7 – Tflex SF10

Tflex SF4, Tflex SF7, and Tflex SF10 are innovative, high-performance thermal materials in Laird's silicone-free gap filler portfolio. This silicone-free technology offers products with excellent deformation properties, resulting in minimal stress on components during deformation. Very little pressure is required to achieve the lowest possible thermal resistance. Thicknesses from 0.5 mm (.020") to 4 mm (.160") in 0.5 mm (.020") increments are available as standard.

Features and benefits

  • Silicone-free formulation
  • Low peak and residual pressure
  • Excellent surface wetting for low contact resistance
  • Exceptionally low thermal resistance
  • UL V-0 flammability classification

Markets and applications

  • Datacom systems
  • Automotive electronics
  • Telecom systems
  • Optical modules
  • Cameras

Storage

  • Storage temperature: 0-35 °C
  • Shelf life: 2 years from date of shipment
  • No change for materials with DF, 1 year for all products with adhesive

Standard thickness

Thermal gap filler – 0.5mm (0.020”) to 4.0mm (0.160”) thick material available in 0.25mm (0.010”) increments. Custom sizes available upon request.

Options

  • DF – eliminate tack from one side 
  • A1 – adhesive added to one side 

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