Use the wrong Surface Finish and it you may have downstream issues during assembly or longer-term reliability issues. But how to make the right choice? For this weeks TECHNOLOGY THURSDAY, we will help you answer this question! What are the options? HAL Leadfree + the highest level of solderability – not the best choice with small via holes or when the board exceeds a normal thickness Chemical Ni/Au + a flat surface, good solderability and acceptable shelf life – complicated with a higher risk of defects, expensive and not for applications which are subject to shocks, bending or strong vibrations Chemical Ag + a flat surface with very good solderability – susceptible to sulfur dioxide (SO²) which tarnishes the surface and creates the AgS² layer What would you choose? Go here to read our full blog: https://www.eurocircuits.com/blog/which-surface-finish-fits-your-design/
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