With the acquisition of the Swedish Webra, Seifert Electronic has acquired the skiving technology. This technique offers engineers new design freedom where conventional cooling profiles fall short. The Flexfin Skiving heat sinks from Seifert are manufactured from a single piece of material – without glue, solder or mechanical connections. This creates a thermally homogeneous structure with optimum heat conduction.
In skiving, fins are “peeled” directly from a solid block of aluminium or copper. This prevents contact resistance between fin and base. Aluminium EN AW-1060 or EN AW-6063 with a thermal conductivity coefficient of up to 230 W/mK is used as the base material; for applications with extremely high power, copper Cu110) can also be used.
Thanks to the direct connection between base and fins, Flexfin heatsinks are not only more efficient, but also lighter and more durable. The one-piece construction does not have the disadvantages of loose fins and aging of connecting materials.
The technology also offers great design freedom:
- cooling profile width <1000mm
- cooling profile length <500mm
- fin height from 3–140 mm
- fin spacing of 0.3–6.5 mm
- base thickness up to 30 mm
For thermally demanding applications such as high power modules, power electronics or thermoelectric systems, skiving offers an attractive alternative. In addition, small series and prototypes can be realized quickly without expensive tooling costs.
The message Skiving technology for compact and efficient cooling solutions first appeared on Elincom.
Source: https://www.elincom.nl/nieuws/skiving-techniek-voor-compacte-en-efficiente-koeloplossingen/
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