Laird is expanding its portfolio with the Tflex™ HR 6.5, a gap pad with excellent thermal conductivity (6.5 W/m K) and impressive mechanical properties. With a springback of up to approximately 30%, this pad continues to function reliably after installation and repeated compression.
Long-term tests show that the Tflex™ HR 6.5 barely increases in thermal resistance, even after 2,000 compression cycles. By comparison, competing gap fillers exhibit up to 400% greater resistance after only 300 cycles due to poor rebound.
The unique material structure also provides extra protection for sensitive components on the printed circuit board (PCB) without excessive pressure. The material is highly resilient, highly ductile, and maintains its performance despite compression, vibration cycles, shocks, or warping. Thanks to this rapid recovery (up to approximately 30%) and the protection of sensitive components without excessive pressure, it is the ideal solution for automated assembly.
Please feel free to contact our specialists for more information, samples or technical advice.
Nederlands