Electronics produce heat. Despite the enormous developments in electronic circuits and conductors, a not insignificant part of the power consumption of each application is converted into the - usually - unwanted by-product heat.

As circuits become more compact and powerful, enclosures become smaller, so the need for effective heat dissipation increases proportionately. Heat sinks are the ideal means of providing the object to be cooled with the largest possible surface area, along which the heat is dissipated. Mostly in the air.

It sounds simple, but there is a lot to consider when choosing the right heat sink. Construction form, air speed and materials used all play an important role in the effectiveness of the chosen cooling method. The thermal resistance of the material, the design of the cooling fins, the aftertreatment and even the color of the heat sink are factors that determine the efficiency of the cooling. In addition, the mounting of the heat sink is also something to take into account. 

Thermal Components

  • Fans, possibly with cable & connector
  • Heat pipes & vapor chambers
  • Push pins, plastic & metal
  • Copper heat spreader
  • Thermal interfaces
  • Peltier elements
  • Springs
  • Various parts
FHI, federatie van technologiebranches
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