Power Module's Reliability and Failure Mechanisms for Energy Storage Application

This presentation will include relevant reliability test specifications and the test results like power cycling, temperature cycling etc. It will also include IGBT failure mechanism- chip related failures, package related failures and Dynex capabilities for failure analysis. Finally, Dynex power module portfolio for energy storage applications

Speaker: Rony Karim – Dynex Semiconductor (on behalf of Ecomal)

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