Program

March 4, 2026 | FHI, Leusden

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Branche
Industrial Electronics

Program

Time
Track 1
Track 2
Track 3
09:00 – 09:30
Reception coffee and tea
09:30 – 09:55
The past and future of wireless communications André Kokkeler – TU Twente
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10:00 – 10:25
Pause
10:30 – 10:55
EMC Test Chambers: Which One Do You Need? Marc Le Roy – Comtest Engineering
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An introduction to quantum computing and qubit control solutions Luk Yi Cheung – Zurich Instruments on behalf of Rohde & Schwarz Benelux
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RF Spectrum Awareness- The symbiosis of IQ streaming Spectrum Analyzer & AI Ferdinand Gerhardes – Anritsu EMEA on behalf of Electrometric
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11:00 – 11:25
Continuous RF threat detection and Geolocation Sven De Coster – CN Red
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Selection of microwave absorber materials for RF applications Johan Kenis – ABS Technics on behalf of EEMC
Designing Flexible Radar RF Architectures for Multi-Mode and Multi-Band Operation Spectrum Control on behalf of Heynen
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11:30 – 11:55
Next-Generation Solderless RF Board-to-Board Interconnect Solutions Pierrick Morel – Radiall on behalf of TTI
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Improve RF Signal Integrity with dispensable RF/Microwave Absorbers Lex van Huuksloot – Telerex Netherlands
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Measuring Shielding and Absorbent Material Effectiveness with Vector Network Analysis Alex Goloschokin – Copper Mountain Technologies on behalf of Acal BFi
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12:00 – 12:55
Pause
1:00 PM – 1:25 PM
EMC Test Chambers: Which One Do You Need? Marc Le Roy – Comtest Engineering
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An introduction to quantum computing and qubit control solutions Luk Yi Cheung – Zurich Instruments on behalf of Rohde & Schwarz Benelux
More information
RF Spectrum Awareness- The symbiosis of IQ streaming Spectrum Analyzer & AI Ferdinand Gerhardes – Anritsu EMEA on behalf of Electrometric
More information
13:30 – 13:55
Continuous RF threat detection and Geolocation Sven De Coster – CN Red
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Selection of microwave absorber materials for RF applications Johan Kenis – ABS Technics on behalf of EEMC
More information
Designing Flexible Radar RF Architectures for Multi-Mode and Multi-Band Operation Spectrum Control on behalf of Heynen
More information
2:00 PM – 2:25 PM
Next-Generation Solderless RF Board-to-Board Interconnect Solutions Pierrick Morel – Radiall on behalf of TTI
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Improve RF Signal Integrity with dispensable RF/Microwave Absorbers Lex van Huuksloot – Telerex Netherlands
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Measuring Shielding and Absorbent Material Effectiveness with Vector Network Analysis Alex Goloschokin – Copper Mountain Technologies on behalf of Acal BFi
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2:30 PM – 2:55 PM
Pause
3:00 PM – 3:25 PM
Radar Development within Robin Radar Silvester Heijnen – Robin Radar
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3:30 PM – 4:30 PM
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