Thermal aging of modern cast inductors

The demand for higher power density and more compact power supplies is driving higher operating temperatures in passive components like molded inductors. This increases the risk of thermal aging, even in inductors with AEC-Q200 Grade 0 certification (-55°C to 150°C).

Thermal aging causes degradation of the encapsulation material and internal structures, leading to changes in electrical properties. The percolation effect plays a crucial role here: changes in the material create or break conductive paths, with consequences for efficiency and EMC.

This aging affects the reliability and performance of the system.
In this presentation we will discuss the causes, effects and critical situations for thermal aging, plus possible solutions to limit it.

Alex Snijder – Würth Elektronik

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