13.30 – 13.55

In this presentation, you will learn how to prevent overheating in printed circuit boards (PCBs) through smart thermal design and the right design standards. We will cover the impact of temperature rise on components, the differences between IPC2152 and IPC2221, and practical methods to dissipate heat effectively. You will also gain insight into LED thermal management and the impact of packages on PCB temperatures. After this session, you will have concrete design strategies and best practices to develop more reliable and durable PCBs.

Speaker: Remco van de Griendt – Würth Elektronik NL

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FHI, federatie van technologiebranches
nl_NLNederlands