While the design and production of printed circuit boards (PCB) is a highly delicate process, it is very difficult to discover manufacturing defects or design imperfections in circuit boards. Traditional optical inspection methods are often insufficient for the identification of major faults. However, alternative inspection methods are available. When a PCB is supplied with voltage, electric current flows through the board, which starts to heat up. PCB thermal fields can then be determined and visualized by Thermal Imaging via a thermal camera. With sufficient knowledge of the thermal field, manufacturing defects can be discovered early in the design process. Thermal imaging can also be effective during series or prototype manufacturing. In this seminar, Thermal Imaging will be discussed in more detail.
Marcel Wiechmann, Hikmicro on behalf of Tooltronics
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