Maker-Ray is an innovative manufacturer of intelligent optical inspection solutions. The company focuses on the research, development, and sale of advanced AOI systems that support the entire PCBA production chain, including THT, SMT, and coating processes.

Maker-Ray is a pioneer in the application of artificial intelligence (AI) Maker-Ray focuses on automated optical inspection, drastically reducing programming times and significantly improving detection accuracy. Thanks to its cutting-edge technology and more than 20 global service centers, Maker-Ray delivers reliable solutions widely used in industries such as automotive electronics, consumer electronics, power supplies, and industrial applications.

Inline 3D AOI AIS431B-HW

The Maker-Ray AIS431B-HW is an advanced inline 3D Automated Optical Inspection (AOI) system, specially designed for SMD inspection with high accuracy and speed. Thanks to the combination of a 21MP area array high speed camera and RGBW light projection The system delivers highly detailed 3D images with a resolution of 10–13 µm and an inspection speed of up to 0.47 sec/FOV.

The system supports a wide range of PCB formats, from 50 × 50 mm to 510 × 460 mm (expandable to 710 × 460 mm in large-board mode), with component heights up to 35 mm above and 80 mm belowFor special applications, the optical structure can be adapted for inspections up to 40 mm height.

Core features and capabilities:

  • Detection of SMD defects: incorrect placement, missing components, polarity errors, offset, shifts, damage, contamination.
  • Solder inspection: height, volume, surface area, excess or insufficient solder, bridging, pseudo-solder, voids and foreign particles.
  • AI algorithms: oa AI skew, AI missing, AI solder insufficient, AI misalignment, multi-scene inspection (incl. mixed panels and automatic program switching).
  • Automatic programming: supports CAD import, quick programming, component library and inline “on-the-fly” fine-tuning.
  • Traceability & data analysis: 1D/2D barcode & QR code recognition, SPC data analysis, OCR, integration with MES via multiple protocols (file, TCP, HTTP, web service).
  • Additional options: 3D buy-off station, 3D offline programming, UPS protection, expandable storage (up to 10 TB).

Hardware and system

  • Camera: 21MP area array camera + projector lamp.
  • Resolution & FOV: 10 µm (51 × 40 mm) / 13 µm (66 × 53 mm).
  • Repeatability: 1 µm (with calibration block).
  • Absolute height accuracy: <1,5% @ 6σ.
  • GRR: <10%.
  • Movement & stability: high-precision screw + servo motor, automatic width adjustment.
  • Operating system: Ubuntu 22.04 LTS 64-bit.
  • Computer: Intel i7 CPU, RTX3060 12G GPU, 128 GB DDR4 memory, SSD + expandable HDD (up to 10 TB).
  • Display: 23.8” FHD.
  • Communication: SMEMA, HTTP, Webservice.
FHI, federatie van technologiebranches
nl_NLNederlands