CHO-BOND 584-208 is a two-component, silver-filled, electrically conductive epoxy adhesive which, under certain conditions, can be used to replace soldered or welded joints.
It is designed for use in high volume applications where a strong, long lasting and low ohmic electrically conductive adhesive bond must be achieved.
The typical resistance is 0.002 ohm-cm and the shear strength is 1000 psi, making it ideal for permanently bonded surfaces.
Typical applications include:
- the fixing and grounding of electrical components,
- as a replacement for cold soldering
- electrically conductive sealing and bonding of composite parts and housings
Full cure of CHO-BOND 584-208 is achieved in just 45 minutes. With a 1:1 ratio, the two components are easy to mix.
Parker Chomerics offers this CHO-BOND in packages of approximately 120ml and 475ml.