Parker Chomerics introduces PAD60, a new thermal interface material that is highly competitive in both price and performance.
With a specified thermal conductivity of 6W/mK, this reasonably soft gap filler is an extremely effective solution between a heat sink and an electronic component.
The competitive price positions the PAD60 in consumer electronics, LED applications, automotive electronics, handheld equipment, etc.
The advantages of this new product are the better heat conduction, easy processing and lower price, which results in a very competitive product. It is with 31 Shore 00 40% softer than the current pads with this cooling capacity and therefore it easily forms to irregular surfaces. It is one of the softest 6W/mK pads on the market.
The material is available in both custom and standard sizes from 0.5 to 5mm thickness. It is V-0 flame retardant and 5,000 Vac/mm electrically insulating. There is also a budget version PAD30 available with a thermal conductivity of 3W/mK.