The choice of the right Thermal Interface Material

A thermal interface material (abbreviated to TIM) is any material inserted between two components to improve the thermal coupling between them. A common use is heat dissipation, where the TIM is inserted between a heat generating device (e.g. an integrated circuit) and a heat dissipating device (e.g. a heat sink). Thermal paste (also known as thermal grease, thermal interface material, or thermal gel) is the semi-liquid compound you apply to the metal casing of the CPU to allow efficient heat transfer to the cooler mounted directly above it.

Thermally conductive paste is loved and hated. The question is often how best to apply the paste. Should you opt for silicone or the silicone-free variant? Is paste even the best choice for your application? Ad Musters from Thal Technologies will address these questions in his lecture and take you through the diverse range of possible TIM materials.

Interested in this lecture or viewing the entire program? Then click here. Via this link you can register free of charge for a visit to the LED conference.