Wire Bonder Demonstrations at the Accelonix Booth

Discover the TPT HB16 – Semi Automatic fine wire bonder at the Accelonix booth – 7B105 during Electronics & Applications 2023.

The HB16 Semi-Automatic series bench top size wire bonder is easy to use and ideal for laboratories, pilot production runs and small scale production lines, configurable with a single bondhead for ball and wedge bonding.

TPT–HB16 Wedge, Ball & Ribbon bonding Gold, aluminum, silver & copper Repeatable Loop profiles Motorized wire clamp User-friendly concept Very flexible for proto & low volume

The TPT HB16 Wire bonder is a manual/semi automatic ultrasonic wire bonder with motorized Z- and Y-axis, used for electrical interconnects between dies and packages/printed circuit boards.
It provides precise manual control of the sample positioning and electronic control of all bonding parameters (temperature, ultrasound power, force, and time).
Just by changing the tool tip on the bondhead the HB16 will perform ball-wedge , wedge-wedge , ribon or ball-bumping.
The wire bond loops can be controlled manually or the loops can be programmed for automatic bonding.

PS: On our booth you will also find solutions for X-Ray inspection, EMC and RF testing and software solutions for electronics (DFT, test coverage, NPI, Traceability and repair).

Click to register your free ticket. Visit us at stand 7B105