EMC, EMI, RF & Au

As electronic systems continue to push the boundaries of speed, density, and integration, the challenges surrounding electromagnetic compatibility (EMC), electromagnetic interference (EMI), and radio‑frequency (RF) performance become increasingly complex. Traditional mitigation strategies—filters, shielding cans, board‑level redesigns—often address symptoms rather than root causes. This presentation introduces a fresh perspective: tackling EMC, EMI, and RF challenges directly at the interconnect and packaging level, using gold wire–based technologies as a powerful enabler.

This session explores how Au wire interconnection concepts can be engineered not only for robust signal integrity at high data rates, but also as an intrinsic part of the shielding and noise‑suppression strategy. By rethinking the physical structure of the interconnect—geometry, bonding configuration, shielding topology, and material properties—engineers can achieve significant improvements in EMC behavior while simultaneously supporting next‑generation high‑speed interfaces.

Toine van Laarhoven / Theo Hooft – SteeRED Technology on behalf of Heynen