Thin Bondlines: The Challenge in Thermal Management of Batteries and Power Electronics

In this presentation, the major liquid gap‑filling technologies are compared in terms of reliability, processability, and thermal performance. Special attention is given to the latest generation of dispensable gap fillers, which combine high thermal conductivity with excellent mechanical stability, controlled compressibility, consistent bondline thickness, and strong electrical insulation. Using test data such as curing behavior, deformation profiles, delamination results, and long‑term thermal and moisture resistance, the performance characteristics are clearly illustrated. The session demonstrates how material selection directly influences assembly efficiency and reliability in demanding power‑electronics and energy‑storage applications.