10.00 – 10.25
Thermal design is essential in modern power electronics, but it rarely comes without side effects. Heatsinks and thermal interface materials (TIMs) enable effective heat dissipation, yet at the same time introduce parasitic capacitances into the system. These can lead to increased EMI emissions and EMC challenges. In this presentation, we demonstrate how thermal solutions can be designed, how they influence the electromagnetic behavior of an application, and why thermal and EMI design must go hand in hand.
Speaker: Louis van Lommel – Würth Elektronik