Next-Generation Solderless RF Board-to-Board Interconnect Solutions

Next-generation solderless RF board-to-board interconnect solutions are revolutionizing beamforming technologies across communication, satellite communications, radar and electronic warfare. Beamforming, crucial for precise directional signal transmission, relies on antenna arrays to enhance signal strength by directing energy to specific receivers.

Traditional 3-component architectures are giving way to innovative solderless solutions, improving RF signal integrity and simplifying assembly and maintenance. By eliminating solder joints, these technologies offer superior RF performance, enhanced design flexibility, and significant cost savings. Integration into cold plates further advances thermal management, structural alignment, and compactness, ensuring durability and robustness under extreme conditions.

Pierrick Morel – Radiall on behalf of TTI