Parker Chomerics introduces the Therm-A-Gap Gel 75, a new one-component thermal conduction paste, based on silicone. With a specified thermal conductivity of 7.5W/mK, this product is intended for high power products, such as power electronics for radar systems or medical systems.
The benefits of this new product are better heat conduction and lower viscosity, resulting in even more than 50% savings on processing time compared to comparable products. But due to the low compressive force, there is also much less stress on the components after curing. This new Therm-A-Gap variant is UL 94-V0 flammable. The relatively solid mass prevents escaping or leaking, which results in less waste.
Therm-A-Gap Gel 75 is available in packaging units from 10cc small hand syringe to large-scale packaging of 25kg for automatic processing.
Parker Chomerics is the market leader in the field of dispensable compounds for thermal conduction and EMC seals with officially established properties, which are required for certified production processes.
Nederlands