New µATX server carrier board

Congatec expanded its ecosystem for modular edge servers. New products include a server carrier board in µATX form factor and COM-HPC Server-on-Modules based on the latest Intel Xeon D processors (Ice Lake). The new µATX server board for COM-HPC modules was developed for compact real-time servers that are used in edge applications and critical infrastructures. The board can be flexibly scaled with the latest high-end COM-HPC Server modules from congatec. Together with the updated modules, which are equipped with the latest Intel Xeon D-1800 and D-2800 processors, customers receive a ready-to-use µATX platform for applications with high performance requirements in a space-saving, robust design.

The new µATX carrier board conga-HPC/uATX server offers maximum I/O and expansion options in a compact standard form factor.

The new conga-HPC/sILL and conga-HPC/sILH Server-on-Modules take advantage of the latest Intel Ice Lake D-1800 LCC and D-2800 HCC processor series, which offers up to 15% more performance at the same TDP compared to the previous D-1700/D-2700 series 8.