14.00 – 14.25
This presentation will include relevant reliability test specifications and the test results like power cycling, temperature cycling etc. It will also include IGBT failure mechanism- chip related failures, package related failures and Dynex capabilities for failure analysis. Finally, Dynex power module portfolio for energy storage applications
Spreker: Rony Karim – Dynex Semiconductor (on behalf of Ecomal)
English (UK)