The LiPOLY Ultra3065 is a high-performance thermal gap filler designed for high-power electronic applications. With an ultra-high thermal conductivity of 30.0 W/m·K, it efficiently transfers heat while accommodating component height variations and uneven surfaces through excellent compressibility and conformability.
Its Shore OOO 65 hardness provides a balance between surface conformity and mechanical support, while its dielectric breakdown strength of 9 kV/mm ensures reliable electrical insulation. Custom thicknesses and dimensions are available for AI servers, GPUs, CPUs, HBM packages, power modules, and other high-density computing applications.
Key Features:
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Thermal conductivity: 30.0 W/m·K.
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Excellent compressibility and conformability.
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Shore OOO 65 hardness.
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Dielectric breakdown strength: 9 kV/mm.
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Reliable thermal interface performance.
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Custom thicknesses and dimensions available.
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Designed for high-power computing and electronic assemblies.