Electronic devices are becoming smaller and more powerful, which means more heat needs to be dissipated. Fortunately, there is an innovative solution: Parker Chomerics THERM-A-GAP GEL 50TBL, an advanced thermal interface material (TIM). This material has a high thermal conductivity of 5.0 W/mK. Even an extremely thin layer of just 0.05 mm can improve heat transfer and optimize the performance of electronic devices.
THERM-A-GAP GEL 50TBL is composed of a silicone matrix with a high density of thermally conductive particles. This material is not only thermally conductive, but also consistent and conformable. This allows it to be easily applied to complex surfaces and adapt to irregularities.
It maintains its thermal and mechanical properties at temperatures ranging from -55 to 200°C. Therefore, it is suitable for applications exposed to extreme temperatures and thermal cycling. THERM-A-GAP GEL 50TBL can be used in various industries such as telecommunications, automotive and aerospace, thanks to its advanced properties and benefits.
The material is available in various packaging units, ranging from 10cc syringes to 3.79 liter buckets.
Nederlands